NTCS0603E3472JHT Vishay, NTCS0603E3472JHT Datasheet - Page 6
NTCS0603E3472JHT
Manufacturer Part Number
NTCS0603E3472JHT
Description
THERMISTOR NTC 4.7K 5% 0603
Manufacturer
Vishay
Series
2381r
Specifications of NTCS0603E3472JHT
Resistance In Ohms @ 25°c
4.7K
Resistance Tolerance
±5%
B Value Tolerance
±1%
B25/85
3830K
Operating Temperature
-40°C ~ 150°C
Power - Max
125mW
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric)
Thermistor Type
NTC
Resistance
4.7kohm
Thermistor Tolerance
± 5%
Beta Value (k)
3830K
Operating Temperature Range
-40°C To +150°C
Thermistor Case Style
0603
No. Of Pins
2
Beta Upper Temperature
85°C
Rohs Compliant
Yes
Beta Lower Temperature
25°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/50
-
B25/75
-
B25/100
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
2381 615 33472
2381 615 33472
238161533472
BC2539TR
2381 615 33472
238161533472
BC2539TR
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29056
Revision: 10-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
P
50
0
1
P
Reflow Soldering
2
TEST METHOD
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
E
F
JWB288
This datasheet is subject to change without notice.
40 s
1.0
Resistance to soldering heat
1
SMD 0603, Glass Protected
W
200
Solderability
NTC Thermistors
0.8
Dimensions of the solder lands
TEST
T
T
250
1
2.4
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
0
0
1
0
1
2
0
0
cover tape
nlr@vishay.com
(1)
(1)
(2)
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
NTCS0603E3.....T
150
Time (s)
< 0.1
1.15
1.75
1.55
Min. 95 % of surface wetted
1.9
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
R/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350
15