NTCS0603E3683HHT Vishay, NTCS0603E3683HHT Datasheet - Page 6
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NTCS0603E3683HHT
Manufacturer Part Number
NTCS0603E3683HHT
Description
THERMISTOR NTC 68K OHM SMD 0603
Manufacturer
Vishay
Type
NTCr
Datasheets
1.NTCS0603E3103JMT.pdf
(7 pages)
2.NTCS0603E3103JMT.pdf
(1 pages)
3.NTCS0603E3683HHT.pdf
(7 pages)
Specifications of NTCS0603E3683HHT
Resistance In Ohms @ 25°c
68K
Resistance Tolerance
±3%
B Value Tolerance
±1%
B25/85
3985K
Operating Temperature
-40°C ~ 150°C
Power - Max
125mW
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric)
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Screening Level
Automotive
Sensitivity Index
3985K
Resistance @ 25c
68kohm
Thermal Time Constant
8s
Percentage Of Resistance Tolerance @ 25c
±3
Accuracy
±1
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
150C
Product Length (mm)
1.6mm
Product Height (mm)
0.8mm
Product Depth (mm)
0.8mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/50
-
B25/75
-
B25/100
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
2381 615 36683
2381 615 36683
238161536683
BC2556TR
2381 615 36683
238161536683
BC2556TR
www.vishay.com
32
NTCS0603E3.....T/2381 615 3....
Vishay BCcomponents
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with
PAPER TAPE
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D 0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A 0
50
B 0
P 1
P 2
Reflow Soldering
TEST METHOD
2 K/s
P 0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
40 s
1.0
Resistance to soldering heat
F
E 1
SMD 0603, Glass Protected
“IEC 60286-3”
200
W
Solderability
0.8
NTC Thermistors
Dimensions of the solder lands
TEST
T 1
T
250
. Basic dimensions are given below. Carrier tape material is paper.
2.4
Notes
(1)
(2)
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
Measured 0.3 mm above base pocket
P
1
0
0
1
0
1
2
0
0
nlr@vishay.com
(1)
(1)
(2)
cover tape
300
250
200
150
100
pitch cumulative error over any 10 pitches ± 0.2 mm
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
1.15
1.75
1.55
1.9
8.0
3.5
4.0
4.0
2.0
1.1
Min. 95 % of surface wetted
200
REQUIREMENTS
Document Number: 29056
ΔR/R < 5 %
250
20 s min.
40 s max.
Revision: 25-May-10
≈ 60 s
TOLERANCE
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
max.
-
350