B57421V2471K62 EPCOS Inc, B57421V2471K62 Datasheet - Page 49
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B57421V2471K62
Manufacturer Part Number
B57421V2471K62
Description
THERMISTOR NTC 470 OHM 10% 0805
Manufacturer
EPCOS Inc
Series
B574**V2r
Type
NTCr
Specifications of B57421V2471K62
Resistance In Ohms @ 25°c
470
Resistance Tolerance
±10%
B Value Tolerance
±3%
B25/50
3940K
B25/85
3980K
B25/100
4000K
Operating Temperature
-55°C ~ 125°C
Power - Max
210mW
Mounting Type
Surface Mount
Package / Case
0805 (2012 Metric)
Resistance
470 Ohms
Tolerance
10 %
Termination Style
SMD/SMT
Operating Temperature Range
- 55 C to + 125 C
Power Rating
210 MW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
B57421V2471K 62
B57421V2471K062
B57421V2471K062
Cautions and warnings
General
See "Important notes" at the end of this document.
Storage
Handling
Soldering
Mounting
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement
SMDs with nickel barrier termination, case size 0805
Store thermistors only in original packaging. Do not open the package before storage.
Storage conditions in original packaging: storage temperature
humidity 75% annual mean, maximum 95%, dew precipitation is inadmissible.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing
material may be deformed or SMDs may stick together, causing problems during mounting.
Avoid contamination of thermistors surface during storage, handling and processing.
Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc).
After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as
possible.
Solder thermistors after shipment from EPCOS within the time specified:
NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs.
Components must not be touched with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
When NTC thermistors are encapsulated with sealing material or overmolded with plastic
material, the precautions given in chapter “Mounting instructions”, “Sealing, potting and
overmolding” must be observed.
Electrode must not be scratched before/during/after the mounting process.
Contacts and housings used for assembly with thermistor have to be clean before mounting.
During operation, the thermistor’s surface temperature can be very high (ICL). Ensure that
adjacent components are placed at a sufficient distance from the thermistor to allow for proper
cooling ot the thermistors.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand this temperature.
Make sure that thermistors (ICLs) are adequately ventilated to avoid overheating.
Avoid contamination of thermistor surface during processing.
SMDs: 12 months
Leaded components: 24 months
Page 49 of 51
25 C ... +45 C, relative
B574**V2