PTGL09AS1R2K2B51A0 Murata Electronics North America, PTGL09AS1R2K2B51A0 Datasheet - Page 19

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PTGL09AS1R2K2B51A0

Manufacturer Part Number
PTGL09AS1R2K2B51A0
Description
THERMISTOR
Manufacturer
Murata Electronics North America
Datasheet

Specifications of PTGL09AS1R2K2B51A0

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
18
1. Mounting Position
2. Reflow Soldering Conditions
3. Flow Soldering Conditions
1
For NTC Thermistors Chip Type !Caution/Notice
Notice (Soldering and Mounting)
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
(NCP15 Series)
(NCP18 Series)
(NCP18 Series)
Allowable Reflow Soldering Temperature and Time
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Allowable Flow Soldering Temperature and Time
280
270
260
250
240
230
220
280
270
260
250
240
230
220
210
0
0
10
10
280
270
260
250
240
230
220
210
20 30 40 50 60 70
0
20 30 40 50 60 70 80
Time (sec.)
Time (sec.)
Time (sec.)
10
20
80
30
90
100
110
90
Component Direction
Mounting Close to Board Separation Line
300
200
100
300
200
100
300
200
100
Perforation
Holes
0
0
0
Standard Soldering Conditions
Standard Soldering Conditions
Preheating: 160 10 C, 1-2 minutes
Soldering: 240-270 C, 20 seconds max.
Preheating: 160 10 C, 1-2 minutes
Soldering: 230-270 C, 20 seconds max.
Preheating: 160 10 C, 1-2 minutes
Soldering: 230-260 C, 10 seconds max.
Preheating (in air)
Preheating (in air)
A
Preheating (in air)
Slit
B
1-2 min.
1-2 min.
1-2 min.
D
C
20 sec. max.
20 sec. max.
Soldering
Soldering
10 sec. max.
Soldering
Continued on the following page.
Keep this product on the
PC Board away from the
Separation Line.
Worst
Gradual cooling
Gradual cooling
Gradual cooling
(in air)
(in air)
(in air)
A-B-C-D
Locate this
product
horizontal to the
direction in
which stress
acts.
Better
R03E.pdf
07.3.21

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