PTGL12AS1R2K3B51A0 Murata Electronics North America, PTGL12AS1R2K3B51A0 Datasheet - Page 78

• Manufacturer Part Number: PTGL12AS1R2K3B51A0
• Description: THERMISTOR
• Manufacturer: Murata Electronics North America

Specifications of PTGL12AS1R2K3B51A0

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(2) Allowable Soldering Temperature and Time
(3) Standard Temperature Profile for Soldering
(4) There may be a risk of unexpected failures
Continued from the preceding page.
(a) Solder within the temperature and time
(b) The excessive soldering conditions may cause
(c) In the event that soldering is repeated more than
(a) Insufficient preheating may cause a crack on
(b) Rapid cooling by dipping in solvent or by other
(tombstone, insufficient solder-wetting, etc.) in the
mounting process, caused by the mounting conditions.
Please make sure that this product is correctly
mounted under specified mounting conditions.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
combinations, indicated by the slanted lines in the
graphs at right.
dissolution of metallization or deterioration of solder-
wetting on the external electrode.
twice, the allowable reflow soldering time should be
the accumulated soldering time.
ceramic body. Difference between preheating
temperature and maximum temperature in the profile
should be 100D.
means is not recommended.
Allowable Reflow Soldering Temp. and Time
Reflow Soldering Conditions
200
100
0
*In the event that soldering is repeated more than twice the
accumulated soldering time should be in the above allowable
soldering time (2).
Preheating: 150T10 C, 1 to 2 minutes
Soldering: 240 C, 20 seconds max.
270
260
250
240
230
220
210
200
Preheating (in air)
0
10
1 to 2 min.
20
Time (second)
30
*20 sec.max.
!Caution/Notice
Soldering
40
240 C
50
Gradual cooling
60
(in air)
R90E.pdf
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