C2012X7R1A106K TDK Corporation, C2012X7R1A106K Datasheet - Page 22

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C2012X7R1A106K

Manufacturer Part Number
C2012X7R1A106K
Description
CAP CER 10UF 10V X7R 10% 0805
Manufacturer
TDK Corporation
Series
Cr
Datasheet

Specifications of C2012X7R1A106K

Voltage - Rated
10V
Capacitance
10µF
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.057" (1.45mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-6857-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C2012X7R1A106K
Manufacturer:
MAXIM
Quantity:
250
Part Number:
C2012X7R1A106K125AC
Manufacturer:
TDK
Quantity:
600 000
No.
5
6
Soldering
Cleaning
Process
5-7. Sn-Zn solder
5-8. Countermeasure for tombstone
2)-2. Excessive washing
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
1)
2)
2)-1. Insufficient washing
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted
soldering.
(Refer to JEITA RCR-2335B Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
If cleaning condition is not suitable, it may damage the chip capacitors.
(1)
(2)
(3)
If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
bring the same result as insufficient cleaning.
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Terminal electrodes may corrode by Halogen in the flux.
Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
—— 21 ——
Washing time : 5 minutes max.
Power : 20 W/ ℓ max.
Frequency : 40 kHz max.
(in longitudinal direction
Condition
)
in the same direction of the reflow

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