MC33341DR2G ON Semiconductor, MC33341DR2G Datasheet - Page 18

• Manufacturer Part Number: MC33341DR2G
• Description: IC CTRLR BATTERY FAST CHRG 8SOIC
• Manufacturer: ON Semiconductor

Specifications of MC33341DR2G

• Function: Charge Management
• Battery Chemistry: All Battery Types
• Voltage - Supply: 2.3 V ~ 16 V
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Product: Charge Management
• Output Current: 50 mA
• Operating Supply Voltage: 2.3 V to 15 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC33341DR2GOS; MC33341DR2GOS; MC33341DR2GOSTR

−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
M
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
PLASTIC PACKAGE
http://onsemi.com
M
N
CASE 751−07
X 45
SOIC−8 NB
MC33341
D SUFFIX
ISSUE AH
_
M
18
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
A
B
C
D
G
H
K
M
N
J
S
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0.050 BSC
0
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_