B57621C5103J062 EPCOS Inc, B57621C5103J062 Datasheet
B57621C5103J062
Specifications of B57621C5103J062
Available stocks
Related parts for B57621C5103J062
B57621C5103J062 Summary of contents
Page 1
... SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination Data sheet Applications - Temperature measurement and compensation for mobile phone applications (e.g. battery pack, TCXO, LCD display), automotive and data systems Features Standard EIA chip size 1206 - SMD NTC with Ni - Barrier termination (Ag/Ni/Sn) ...
Page 2
... SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination Data sheet Resistance - Temperature Characteristic R at 25°C = 10000 ± 3530 K ± 3% 25/100 T R_Nom [°C] -55,00 528.264,00 -50,00 386.430,00 -45,00 285.744,00 -40,00 213.457,00 -35,00 161.003,00 -30,00 122.555,00 -25,00 94.071,00 -20,00 72.862,00 -15,00 56.835,00 -10,00 44 ...
Page 3
... Test conditions Storage at upper category temperature T: 125°C t: 1000h Temperature of air: 40°C relative humidity of air: 93% Duration: 21days Lower test temperature: -55°C Upper test temperature: 125°C Number of cycles =300mW max Duration: 1000h Solderability: 215°C/3s (Pb-cont. solder) 245°C/3s (Pb-free solder) Resistance to soldering heat: 260° ...
Page 4
... Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9) Bath temperature (°C): 245 Dwell time (s): 3 0.3 - Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) : Preconditioning: Immersion into flux F-SW 32. Evaluation criteria: Leaching of side edges Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9) Bath temperature (°C): 260 Dwell time (s ISSUE DATE 02.09. ...
Page 5
... Reflow soldering profile: (according to CECC 00802) Temperature characteristics at component terminals during reflow soldering (two cycles are permitted). Wave soldering profile: Temperature characteristics at component terminals during wave soldering can be recommended once in general. 5. Storage conditions Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier termination, provided that the components are stored in the original packages. Storage temperature: -25 ... +45° ...
Page 6
SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination Data sheet Taping and Packing Taping: Tape and reel packing comply with specifications of IEC 60286-3 Section A-A Definition Compartment width x Compartments length Compartment height Overall thickness Sprocket hole diameter ...
Page 7
SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination Data sheet Reel Packing: Reel material: PS. Tape material: Blister Tape break force: min. 10N Top cover tape peel force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle ...