XF2H-2015-1 Omron, XF2H-2015-1 Datasheet - Page 17
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XF2H-2015-1
Manufacturer Part Number
XF2H-2015-1
Description
CONN FPC 20POS 0.5MM SMT
Manufacturer
Omron
Series
XF2Hr
Type
FPC Connectorr
Datasheet
1.XF2L-0725-1.pdf
(28 pages)
Specifications of XF2H-2015-1
Connector Type
Top and Bottom Contacts
Number Of Positions
20
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.079" (2.00mm)
Mounting Type
Surface Mount, Right Angle
Cable End Type
Straight
Termination
Solder
Locking Feature
Rotary Lock, Backlock
Features
Zero Insertion Force (ZIF)
Contact Finish
Tin Alloy
Contact Finish Thickness
79µin (2.00µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Polyamide (PA46), Nylon 4/6
Contact Gender
SKT
Mounting Style
Surface Mount
Number Of Contact Rows
1
Number Of Contacts
20POS
Pitch (mm)
0.5mm
Body Orientation
Right Angle
Contact Resistance Max
30mOhm
Voltage Rating Max
50VDC
Operating Temp Range
-30C to 85C
Current Rating (max)
0.5A
Housing Color
Natural
Contact Material
Copper Alloy
Contact Plating
Tin Alloy on Nickel
Termination Method
Solder
Product Height (mm)
3.44mm
Product Depth (mm)
8.1mm
Product Length (mm)
14.1mm
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
OR644TR
XF2H20151
XF2H20151
Greater Freedom in Board Design with a Bottom
Wall and the Smallest On-board Area in the Industry
• Smallest on-board area and volume in the industry.
• Low on-board profile of only 1.2 mm.
• Highest board design surface efficiency in the industry with
• Construction with secure slider locking mechanism.
• Applicable FPC thickness of 0.3 mm.
■ Ratings and Specifications
XF2L-@@@5-1A
■ Dimensions
Table of Dimensions
Upper-contact Models
XF2L-@@@5-1@
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
note 2.)
ZIF Slide-locking Connector
(0.5-mm Pitch)
RoHS Compliant
a bottom wall preventing terminal exposure.
Pins
(See
1.05
10
12
13
18
21
26
30
4
6
7
8
9
1
XF2L- @@25-1 (Upper-contact Models)
XF2L- @@35-1 (Lower-contact Models)
(See note 1.)
XF2L-0425-1@
XF2L-0625-1@
XF2L-0725-1@
XF2L-0825-1@
XF2L-0925-1@
XF2L-1025-1@
XF2L-1225-1@
XF2L-1325-1@
XF2L-1825-1@
XF2L-2125-1@ 10.0 14.4 15.4 11.1 14.38 15.38 13.78 15.78
XF2L-2625-1@ 12.5 16.9 17.9 13.6 16.88 17.88 16.28 18.28
XF2L-3025-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
Model
0.5
0.5 A AC/DC
50 V AC/DC
30 m Ω max.
(at 20 mV DC max., 100 mA max.)
250V AC for 1 min.
(leakage current: 1 mA max.)
20 times
− 30 to 85 ° C
(with no icing or condensation)
D
B
A
C
D
A
1.5
2.5
3.0
3.5
4.0
4.5
5.5
6.0 10.4 11.4
8.5 12.9 13.9
0.2
B
5.9
6.9
7.4
7.9
8.4
8.9
9.9 10.9
C
6.9
7.9
8.4
8.9
9.4
9.9
D
2.6
3.6
4.1
4.6
5.1
5.6
6.6
7.1 10.38 11.38
9.6 12.88 13.88 12.28 14.28
5.88
6.88
7.38
7.88
8.38
8.88
9.88 10.88
0.75
E
2.5 min.
0.35
0.5
6.88
7.88
8.38
8.88
9.38
9.88
Applicable FPC Dimensions
F
3.05
±0.1
±0.03
3.05
3.45
3.45
5.28
6.28
6.78
7.28
7.78
8.28 10.28
9.28 11.28
9.78 11.78
G
(D−0.1)
1.2
1.2
0.5
A
7.28
8.28
8.78
9.28
9.78
H
±0.05
±0.05
±0.05
With slider open
With slider open
■ Materials and Finish
XF2L-@@@5-1A
Lower-contact Models
Reinforcement board
Ordering
Housing
Slider
Contacts
Hold-down Spring copper alloy/fused-tin plating (1.5 μ m)
1.35 (Effective
interface length)
T=0.3±0.03
(Conductive plating)
note 2.)
4.55
4.55
Pins
(See
10
12
13
15
18
19
20
22
24
30
(See note.)
5
6
7
8
Model
(5)
(See note 1.)
XF2L-0535-1@
XF2L-0635-1@
XF2L-0735-1@
XF2L-0835-1@
XF2L-1035-1@
XF2L-1235-1@
XF2L-1335-1@
XF2L-1535-1@
XF2L-1835-1@
XF2L-1935-1@
XF2L-2035-1@
XF2L-2235-1@ 10.5 14.9 15.9 11.6 14.88 15.88 14.28 16.28
XF2L-2435-1@ 11.5 15.9 16.9 12.6 15.88 16.88 15.28 17.28
XF2L-3035-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
0.55
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
Model
1.34
(Upper-contact Models)
±0.1
±0.1
1
±0.1
Note. Use polyimide and thermoset adhesive for
XF2L
PCB Mating Dimensions (Top View)
A
2.0
2.5
3.0
3.5
4.5
5.5
6.0 10.4 11.4
7.0 11.4 12.4
8.5 12.9 13.9
9.0 13.4 14.4 10.1 13.38 14.38 12.78 14.78
9.5 13.9 14.9 10.6 13.88 14.88 13.28 15.28
reinforcement film material.
B
6.4
6.9
7.4
7.9
8.9
9.9 10.9
0.5
C
7.4
7.9
8.4
8.9
9.9
±0.05
A
G
H
D
3.1
3.6
4.1
4.6
5.6
6.6
7.1 10.38 11.38
8.1 11.38 12.38 10.78 12.78
9.6 12.88 13.88 12.28 14.28
LCP resin (UL94V-0)/
brown
±0.05
F
E
±0.1
±0.1
XF2L
(Lower-contact Models)
0.25
6.38
6.88
7.38
7.88
8.88
9.88 10.88
+0.05
E
0
XF2L
7.38
7.88
8.38
8.88
9.88
F
5.78
6.28
6.78
7.28
8.28 10.28
9.28 11.28
9.78 11.78
G
7.78
8.28
8.78
9.28
H
17