609961 MULTICORE (SOLDER), 609961 Datasheet
609961
Manufacturer Part Number
609961
Description
SOLDER WIRE, CRYSTAL 400, 0.71MM, 250G
Manufacturer
MULTICORE (SOLDER)
Datasheet
1.609961.pdf
(2 pages)
Specifications of 609961
External Diameter
0.71mm
Material Composition
60% Tin, 40% Lead Alloy
Melting Temperature
188°C
Weight
250g
Wire Size Swg
22SWG
Bit Temperature
340°C
Flux Type
400, Rosin Based, Halide
Outer Diameter
0.71mm
Solder Alloy
60/40 Sn/Pb
Solder Gauge Swg
22SWG
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Multicore Crystal solid fluxes for cored solder wires
have been specially formulated to complement No
Clean wave and reflow soldering processes. They are
also applicable to repair operations carried out after
a cleaning process, eliminating the need for further
cleaning.
Multicore Crystal 400 is designed for users who require a
halide free formulation while Crystal 500 contains the low
level of halide permitted in the obsolete RMA specification.
The remaining products in the range contain higher halide
levels to maximise soldering power.
wires are manufactured with a range of flux contents.
Although users will normally be using products with a
nominal flux content of 3%, the superior performance of
the Crystal products may allow a lower flux content to be
specified e.g. 2.2%. This will further improve residue
appearance by reducing the quantity. All are available in
alloys conforming to national and international standards,
including lead free alloys. Some alloys and flux contents
may be manufactured to special order.
Soldering iron: Good results should be obtained using a
range of tip temperatures. However, the optimum tip
temperature and heat capacity required for a hand
soldering process is a function of both soldering iron
design and the nature of the task and care should be
exercised to avoid unnecessarily high tip temperatures for
excessive times. A high tip temperature will increase any
tendency to flux spitting and it may produce some residue
darkening.
PRODUCT RANGE
RECOMMENDED OPERATING
CONDITIONS
Multicore Crystal 400, 500, 502, 505 and 511 cored
Halide free version - Crystal 400
RMA version - Crystal 500
Fast soldering - range of activities to suit all
applications
Good spread on copper, brass and nickel
Clear residues
Heat stable - low spitting
Mild odour
NO CLEAN CLEAR RESIDUE
CORED SOLDER WIRES
TM
400, 500, 502, 505 & 511
may be achieved using Multicore Crystal cored wire.
Severely contaminated soldering iron tips should first be
cleaned and pre-tinned using Multicore Tip Tinner/Cleaner
TTC1, then wiped on a clean, damp sponge before
re-tinning with Crystal cored wire.
Soldering process: Multicore Crystal flux cored wires
contain a careful balance of resins and activators to
provide clear residues, maximum activity and high residue
reliability, without cleaning in most situations. To achieve
the best results from Multicore Crystal solder wires,
recommended working practices for hand soldering should
be observed as follows:
thermal mass, tip temperature and configuration and the
solderability of the surfaces to be joined.
soldering on copper and brass surfaces as well as solder
coated materials. Activity of the halide activated versions
on nickel is also good depending on the state of oxidation
of the nickel finish. The good thermal stability of Crystal
fluxes means they are also well suited to soldering
applications requiring high melting temperature alloys.
relatively low residues and to minimise residual activity.
This is achieved by ensuring some decomposition and
volatilisation takes place during the soldering process. In
some situations, this may generate visible fuming but in all
cases, rosin fumes must be removed from the breathing
zone of operators.
Cleaning: Multicore Crystal flux cored solder wires have
been formulated to leave pale flux residues and to resist
spitting and fuming. In most industrial and consumer
electronics applications cleaning will not be required and
The soldering iron tip should be properly tinned and this
Apply the soldering iron tip to the work surface,
ensuring that it simultaneously contacts the base
material and the component termination to heat both
surfaces adequately. This process should only take a
fraction of a second.
Apply Crystal flux cored solder wire to a part of the joint
surface away from the soldering iron and allow to flow
sufficiently to form a sound joint fillet - this should be
virtually instantaneous. Do not apply excessive solder or
heat to the joint as this may result in dull, gritty fillets
and excessive or darkened flux residues.
Remove solder wire from the workpiece and then
remove the iron tip.
The total process will be very rapid, depending upon
Multicore Crystal flux cored solder wires provide fast
The resin and flux systems are designed to leave
www.multicore.com
609961 Summary of contents
Page 1
... This process should only take a fraction of a second. Apply Crystal flux cored solder wire to a part of the joint surface away from the soldering iron and allow to flow sufficiently to form a sound joint fillet - this should be virtually instantaneous ...
Page 2
... No Clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second cleaning process. Should residue quantity be an important consideration, Multicore X39 flux cored wire may be specified if a halide free product is required or X52 if halide may be tolerated ...