67913-0002 Molex Inc, 67913-0002 Datasheet - Page 5

CONN MEMORY SD I/O BOTTM MT SMD

67913-0002

Manufacturer Part Number
67913-0002
Description
CONN MEMORY SD I/O BOTTM MT SMD
Manufacturer
Molex Inc
Series
67913r
Datasheets

Specifications of 67913-0002

Card Type
Secure Digital - SD
Mounting Type
Surface Mount, Right Angle
Number Of Positions
12 (9 + 3)
Connector Type
Connector and Ejector
Insertion, Removal Method
Push In, Push Out
Features
Board Guide, Switch
Height Above Board
0.108" (2.75mm)
Mounting Feature
Reverse - Bottom
Contact Finish
Gold
Product
Card Connectors
Pitch
2.5 mm
Orientation
Right Angle
Mounting Style
SMD/SMT
Number Of Contacts
9
Current Rating
0.5 A
Voltage Rating
100 V
Contact Material
Stainless Steel
Contact Plating
Gold
Height
2.75 mm
Insertion - Extraction Style
Push-Push
Mounting Angle
Right
Number Of Positions / Contacts
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Ejector Side
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
067913-0002
067913-0002-C
0679130002
0679130002-C
67913-0002-C
679130002
679130002-C
WM23962TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
67913-0002
Manufacturer:
MOLEX
Quantity:
12 000
DOCUMENT NO.
ENVIRONMENTAL
Moisture Resistance
Temperature Rise
REV
A
Solderability
Vibration
Shock
Item
REVISE ON PC ONLY
PS-67913-002
DESCRIPTION
SEE SHEET 1
Mate dummy card and sbject to the
following vibration conditions, for a period of
2 hours in each of 3 mutually perpendicular
axis, passing DC 1mA during the test.
shall be traversed in 1 minute.
( MIL-STD-202 Method 201 )
Mate dummy card and subject to the
following shock conditions. 3 shocks shall
be applied along 3 mutually perpendicular
axis, passing DC 1mA current during the
test. ( Total of 18 shocks)
Test Pulse: Half Sine.
Peak Value : 490m/s
Duration : 11ms
( MIL-STD-202 Method 213,)
Matedummy card and subject to the condi-
tions specified on per.( 6) for 9 cycles. The
test specimens shall exposed to step 7a
during only 5 out of 9 cycles. A 10th cycles
consisting of only step 1 through 6 is then
performed, after which the test specimens
shall be conditioned at ambient room condi-
tions for 24 hours.
(MIL-STD-202 Method 106)
Dip solder tails into the molten solder ( held
at 230 +5
of tail for 3+/-0.5sec.
Mated with dummy card measure the
temperature rise at the rated current after
96 hours
PRODUCT SPECIFICATION
Amplitude
Frequency : 10-55-10 Hz
o
C/-5
Test Condition
o
C ) up to 0.5mm from the tip
: 1.52mm P-P
TITLE
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX
C
2
RITICAL
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
SD MEMORY CARD CONNECTOR FOR CARD
DIMENSION CLASS:
.PDF
HEADER WITH EJECTOR MECHANISM
= 0
MAJOR =
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage
Contact resistance: 100 milliohms
MAX.
Dielectric strength : Must meet
electrical requirement.
Insulation resistance : 100 Megohms
Minimum.
Solder coverage : 95% Min.
Temperature rise
30
o
C Maximum
0
Requirement
PS-67913-002.
FILE NAME
PDF
LANGUAGE
ENGLISH
SHEET
5

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