48094-0001 Molex Inc, 48094-0001 Datasheet - Page 4

• Manufacturer Part Number: 48094-0001
• Description: CONN MEMORY STCK 10POS 1.5MM SMD
• Manufacturer: Molex Inc
• Series: 48094r

Specifications of 48094-0001

• Card Type: Memory Stick™
• Number Of Positions: 10
• Connector Type: Connector and Ejector
• Insertion, Removal Method: Push In, Push Out
• Ejector Side: Left
• Mounting Type: Surface Mount, Right Angle
• Features: Board Guide
• Height Above Board: 0.110" (2.80mm)
• Mounting Feature: Normal, Standard - Top
• Contact Finish: Gold
• Contact Finish Thickness: 10µin (0.25µm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 048094-0001; 048094-0001-E; 0480940001; 0480940001-E; 48094-0001-E; 480940001; 480940001-E; WM23963

DOCUMENT NO.
PS-48094-001
10 Mechanical Shock
11 Heat Resistance
12 Cool Resistance
13 Humidity
14 Vibration
15 Gas (H
16
17 Solder ability
18
REV
MOLEX TAIWAN
A
DESIGN CETER
Resistance to IR
reflow
Temperature
Cycling
REVISE ON PC ONLY
2
DESCRIPTION
S)
T2004-0115
STATUS
PRODUCT SPECIFICATION
No electrical discontinuity of 1
Microsecond or longer duration.
△R=10mΩ maximum
No physical damage allowed
△R=10mΩ maximum
No physical damage allowed
△R=10mΩ maximum
No physical damage allowed
△R=10mΩ maximum
No physical damage allowed
No electrical discontinuity of 1
Microsecond or longer duration.
△R=10mΩ maximum
No physical damage allowed
Contact resistance:80mΩ Max.
No physical damage allowed
Wet solder coverage: 95% min.
△ R=10mΩ maximum
No physical damage allowed
TITLE:
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
HU YAN MING
WRITTEN BY:
ENVIRONMENTAL
MEMORY STICK CONNECTOR
Sam Shin
CHECK BY:
Accelerated Velocity:50G Wave form:
Half-sine,
shocks in each direction shall be applied
along the three mutually perpendicular
axes of the test specimen (18 shocks).
MIL-STD-202,method 213,Condition B.
Mated connector,85℃±3ºC , 250 Hrs.
EIA 364-17
Mated connector,-55℃±3ºC , 96 Hrs.
EIA 364-17
Mated connector,90~95%R.H.40℃±2ºC ,
96 Hrs.
EIA-364-31B&IEC-60512-11-3.
Amplitude
Sweep time :10-55-10 Hz in 1min.
Duration
mutually perpendicular planes.
MIL-STD-1344A,Method 2005.1,
Condition V Test Condition letter A.
Mated connector, 3PPM H
RH, 96 hours.
Temperature:100~150℃ for 60s Min, 210
℃for 30s Max, peak:230℃,
MIL-STD-202,Method 210
Solder temperature: 230±2ºC
Immersion duration: 3 seconds max.
Mated connector
-55±3ºC/30 min, room temp: 10~15 min
85±2ºC/30 min, room temp: 10~15 min
making this a cycle, repeat 5 cycles
APPROVED BY:
Eric Lan
: 1.5 hours in each of 3
Duration: 11msec.
: 1.5mm P-P,
PS4809401.pdf
FILE NAME
DATE:YR/MO/DAY
2
2004/01/20
S, 40ºC, 80%
LANGUAGE
ENGLISH
Three
SHEET
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