C200HW-BC081-V1 Omron, C200HW-BC081-V1 Datasheet - Page 70
![no-image](/images/manufacturer_photos/0/4/494/omron_sml.jpg)
C200HW-BC081-V1
Manufacturer Part Number
C200HW-BC081-V1
Description
MASTER MODULE
Manufacturer
Omron
Specifications of C200HW-BC081-V1
Leaded Process Compatible
No
Peak Reflow Compatible (260 C)
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Installation Environment
Backplane Insulation Plates
Insulation Plates for CPU Backplanes
Insulation Plates for CPU Backplanes
3-1-5 DIN Track Mounting
Note Never use DIN Track to mount Backplane in locations subject to vibration.
If there is an electric potential difference between grounds when devices are
wired separately, then use a Backplane Insulation Plate. There are four models
available, corresponding to the number of slots in the Backplane. The dimen-
sions at locations A, B, C, D, and E are shown below in millimeters for each Back-
plane Insulation Plate model.
The PC may be mounted using DIN track if desired. This type of mounting is not
required, and the PC may be directly mounted to any sturdy support meeting the
environmental specifications (refer to Appendix B Specifications). If you want to
mount the PC on DIN track, you can order a DIN Track from OMRON (refer to
Appendix B Standard Models). DIN Tracks come in the two heights shown
below.
135 (118) 110
Specifications
Specifications
p
p
For 10 slots
For 10 slots
For 3 slots
For 5 slots
For 8 slots
For 3 slots
For 5 slots
For 8 slots
M4 screws for mounting to PC
(4/5 places)
C200HW-ATTA2
C200HW-ATT32
C200HW-ATT52
C200HW-ATT82
C200H-ATT31
C200H-ATT51
C200H-ATT81
C200H-ATTA1
Model
Model
(A)
(E)
D
261
331
436
506
190
260
365
435
E
E
(B)
C
210
280
385
455
140
210
315
385
D
D
Dimensions (mm)
Dimensions (mm)
5-dia. holes for mounting
Base Insulation Plate
(4/6 places)
227.5
---
---
---
---
---
---
---
C
C
12 dia.
270.5
Section 3-1
---
---
---
---
---
---
---
10
B
B
5 dia.
6
246
316
421
491
175
245
350
420
A
A
55
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