44828-1162 Molex Inc, 44828-1162 Datasheet - Page 8

• Manufacturer Part Number: 44828-1162
• Description: CONN RCPT 16POS .8MM RT/ANG SMD
• Manufacturer: Molex Inc
• Series: HandyLink™ 44828r

Specifications of 44828-1162

• Connector Style: Receptacle
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Surface Mount, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Thermoplastic, High Temperature
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Right
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold
• Contact Material: High Performance Alloy (HPA)
• Gender: Female
• Current Rating: 1.5 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 044828-1162; 044828-1162-C; 0448281162; 0448281162-C; 44828-1162-C; 448281162; 448281162-C; WM17127TR

DOCUMENT NUMBER:
REVISION:
5.0 SOLDERING PROCESS RECOMMENDATIONS
5.1 44828 SMT Receptacle Connector
5.2 45560 SMT Cradle Connector
B
4.3
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see
Section 6.4 Design Best Practices for further detailed information.
5.1.1
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.
5.1.2
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.1.4
Solder joints should be inspected using established conventional methods.
5.2.1
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is
required.
5.2.2
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
Clearances Between Mated Parts
PCB Layout
Solder Paste Stencil Layout
Reflow Profile
Inspection
PCB Layout
Solder Paste Stencil Layout
SD-44828-001
EC No:
DATE:
ECR/ECN INFORMATION:
UCP2008-0962
2007/10/30
TITLE:
APPLICATION SPECIFICATION
CREATED / REVISED BY:
M. Simmel / D. Morgan
HANDYLINK™
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
CHECKED BY:
B. Barker
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
S. Miller
SHEET No.
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