ADS-932MM Murata Power Solutions Inc, ADS-932MM Datasheet - Page 6

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ADS-932MM

Manufacturer Part Number
ADS-932MM
Description
Analog To Digital Converter
Manufacturer
Murata Power Solutions Inc
Datasheets
ADS-932
THERMAL REQUIREMENTS
All DATEL sampling A/D converters are fully characterized and
specified over operating temperature (case) ranges of 0 to
+70°C and –55 to +125°C. All room-temperature (T
production testing is performed without the use of heat sinks
or forced-air cooling. Thermal impedance figures for each
device are listed in their respective specification tables.
These devices do not normally require heat sinks, however,
standard precautionary design and layout procedures should
be used to ensure devices do not overheat. The ground and
power planes beneath the package, as well as all pcb signal
runs to and from the device, should be as heavy as possible to
help conduct heat away from the package. Electrically
insulating, thermally-conductive "pads" may be installed
INTERNAL S/H
Notes:
CONVERT
OUTPUT
START
1.
2.
3.
DATA Data N-4 Valid
–100
–110
–120
–130
–140
–150
–160
–170
EOC
–10
–20
–30
–40
–50
–60
–70
–80
–90
Scale is approximately 50ns per division. fs = 2MHz.
This device has three pipeline delays. Four start convert pulses (clock cycles) must be applied for valid data
from the first conversion to appear at the output of the A/D.
The start convert positive pulse width must be between either 40 and 175nsec or 280 and 460nsec
(when sampling at 1MHz) to ensure proper operation. For sampling rates lower than 1MHz, the start pulse
can be wider than 460nsec, however a minimum pulse width low of 40nsec should be maintained. A 1MHz
clock with a 100nsec positive pulse width is used for all production testing.
0
0
20ns typ.
N
100
Hold
20ns typ.
(fs = 2MHz, fin = 975kHz, Vin = –0.5dB, 16,384-point FFT)
100ns typ.
75ns typ.
200
Figure 4. FFT Analysis of ADS-932
Figure 3. ADS-932 Timing Diagram
A
300
Data N-3 Valid
= +25°C)
60ns typ.
N+1
Conversion Time
275ns typ.
260ns typ.
400
Frequency (kHz)
Acquisition Time
Invalid
Data
500
6
225ns typ.
underneath the package. Devices should be soldered to
boards rather than "socketed", and of course, minimal air flow
over the surface can greatly help reduce the package
temperature.
In more severe ambient conditions, the package/junction
temperature of a given device can be reduced dramatically
(typically 35%) by using one of DATEL's HS Series heat sinks.
See Ordering Information for the assigned part number. See
page 1-183 of the DATEL Data Acquisition Components
Catalog for more information on the HS Series. Request
DATEL Application Note AN-8, "Heat Sinks for DIP Data
Converters," or contact DATEL directly, for additional
information.
Data N-2 Valid
440ns typ.
600
45ns typ.
N+2
700
Invalid
Data
800
Data N-1 Valid
N+3
900
1000
®
®

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