PAF600F280-28 TDK Corporation, PAF600F280-28 Datasheet - Page 49

• Manufacturer Part Number: PAF600F280-28
• Description: 28V@21.5A
• Manufacturer: TDK Corporation

“Thermal Design” .
・All specifications are subject to change without notice.
PAF
conditions:
● Operation of Over Current Protection (OCP)
● Light load conditions at parallel operation
● Dynamic load operation
 Auxiliary power supply for external signals (AUX terminal)
For AUX terminal, output voltage value is within 10 - 14
VDC range, maximum output current is 20mA. Ground for
the AUX terminal is –S terminal.
Avoid short circuit of AUX terminal with other terminals as
this would lead to power module damage.
 Operating Ambient Temperature
There is no restriction on mounting direction but there
should be enough consideration for airflow so that heat
does not accumulate around the power module vicinity.
Determine external components configuration and mount-
ing direction on PCB such that air could flow through the
heatsink at forced cooling and conventional cooling.
By maintaining actual baseplate temperature below 100℃,
operation is possible.
For details on thermal design, refer to Application Notes
Note) 1. Maximum baseplate temperature is 100℃. For worst
For better improvement of power module reliability, derat-
ing of baseplate temperature when using is recommended.
Fig.15-1 Temperature Measurement Point of Baseplate
2. There is limitation on baseplate temperature range for
case operating condition, verify baseplate temperature
at measurement point indicated in fig. 15-1.
as shown in fig.15-2 and Fig.15-3.
450F280, 600F280
100
100
80
60
40
20
Fig.15-2 PAF450F280 Derating Curve
Fig.15-3 PAF600F280 Derating Curve
80
60
40
20
0
0
-40
-40
-20
-20
Vo: 12V, 24V, 28V, 48V（Vin≦380V）
Vo: 48V（Vin＞380V）
Vo: 12V, 24V, 28V, 48V （Vin≦380V）
Vo: 48V （Vin＞380V）
Baseplate Temperature（℃）
0
0
Baseplate Temperature （℃）
20
20
40
40
60
60
Temperature
Measuring Point
of Baseplate
80
80
85
94
100
100
“Thermal Design” .
 Operating Ambient Humidity
Take note that moisture could lead to power module ab-
normal operation or damage.
 Storage Ambient Temperature
Abrupt temperature change would cause moisture forma-
tion that leads to poor solderability of each terminal of the
power module.
 Storage Ambient Humidity
Take enough care when storing the power module be-
cause rust which causes poor solderability would form in
each terminal when stored in high temperature, high hu-
midity environment.
 Cooling Method
Operating temperature range is specified by the baseplate
temperature. Therefore, several method of heat dissipation
is possible.
For details on thermal design, refer to Application Notes
 Baseplate Temperature vs. Output Voltage Drift
Output voltage drift is defined as the rate of voltage
change when baseplate temperature only is changed dur-
ing operation.
 Withstand Voltage
This power module is designed to have a withstand volt-
age of 2.5kVAC between input and baseplate, and 3kVAC
between input and output for 1 minute.
When conducting withstand voltage test during incoming
inspection, be sure to set the current limit value of the
withstand voltage testing equipment to 20mA.
This power module is designed to have a withstand value
of 500VDC between output and baseplate for 1 minute.
When conducting withstand voltage test during incoming
inspection, be sure to apply DC voltage.
Be sure to avoid conducting test with AC voltage because
this would cause power module damage.
Furthermore, avoid throw in or shut off of the testing equip-
ment when applying or when shutting down the test volt-
age. Instead, gradually increase or decrease the applied
voltage. Take note especially not to use the timer of the
test equipment because when the timer switches the ap-
plied voltage off, impulse voltage which has several times
the magnitude of the applied voltage is generated causing
damage to the power module.
Connect the terminals as shown in fig.21-1, fig.21-2 and
fig.21-3.
When conducting test by the basic connection shown in
fig.1-2, connect the terminals similarly.
B-141
PAF