BZM55C3V9-TR Vishay, BZM55C3V9-TR Datasheet

ZENER DIODE, 500mW, 4.1V, MICROMELF

BZM55C3V9-TR

Manufacturer Part Number
BZM55C3V9-TR
Description
ZENER DIODE, 500mW, 4.1V, MICROMELF
Manufacturer
Vishay
Datasheets

Specifications of BZM55C3V9-TR

Zener Voltage Vz Typ
4.1V
Power Dissipation Pd
500mW
Diode Case Style
MicroMELF
No. Of Pins
2
Diode Type
Zener
Peak Reflow Compatible (260 C)
Yes
Termination Type
SMD
Zener Voltage
3.9 V
Voltage Tolerance
5 %
Voltage Temperature Coefficient
- 0.065 % / C
Power Dissipation
500 mW
Maximum Reverse Leakage Current
2 uA
Maximum Zener Impedance
90 Ohms
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Package / Case
DO-213AB
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BZM55C3V9-TR
Manufacturer:
VISHAY/威世
Quantity:
20 000
Silicon Epitaxial Planar Z-Diodes
Features
Applications
Voltage stabilization
Absolute Maximum Ratings
T
Maximum Thermal Resistance
T
Electrical Characteristics
T
Document Number 85597
Rev. 7, 10-Jun-03
VISHAY
• Saving space
• Hermetic sealed parts
• Electrical data identical with the devices
• Fits onto SOD 323 / SOD 110 footprints
• Very sharp reverse characteristic
• Low reverse current level
• Very high stability
• Low noise
• Available with tighter tolerances
Power dissipation
Z-current
Junction temperature
Storage temperature range
Junction ambient
Junction tie point
Forward voltage
amb
amb
amb
BZT55..Series / TZM..Series
= 25 °C, unless otherwise specified
= 25 °C, unless otherwise specified
= 25 °C, unless otherwise specified
Parameter
Parameter
Parameter
mounted on epoxy-glass hard
tissue, Fig. 1
35 µm copper clad, 0.9 mm
copper area per electrode
I
F
= 200 mA
Test condition
Test condition
R
thJA
≤ 300 K/W
2
Test condition
Mechanical Data
Case: MicroMELF
Weight: 12.3 mg
Packaging codes/options:
TR / 2.5k per 7" reel, 12.5k/box
TR3 / 10k per 13" reel, 10k/box
Symbol
V
F
Symbol
R
R
thJA
thJL
Min
9612315
Symbol
BZM55..Series
Vishay Semiconductors
T
P
Value
I
T
stg
500
300
Typ.
Z
V
j
- 65 to + 175
Value
P
500
175
V
Max
1.5
/V
Z
www.vishay.com
K/W
K/W
Unit
Unit
mW
mA
Unit
°C
°C
V
1

Related parts for BZM55C3V9-TR

BZM55C3V9-TR Summary of contents

Page 1

... Packaging codes/options 2.5k per 7" reel, 12.5k/box TR3 / 10k per 13" reel, 10k/box Test condition ≤ 300 K/W R thJA Test condition Symbol R thJA 2 R thJL Test condition Symbol V F BZM55..Series Vishay Semiconductors 9612315 Symbol Value P 500 175 175 stg Value ...

Page 2

... Zener Voltage 1) Range min max BZM55C2V4 2.28 2.56 BZM55C2V7 2.5 2.9 BZM55C3V0 2.8 3.2 BZM55C3V3 3.1 3.5 BZM55C3V6 3.4 3.8 BZM55C3V9 3.7 4.1 BZM55C4V3 4 4.6 BZM55C4V7 4.4 5 BZM55C5V1 4.8 5.4 BZM55C5V6 5.2 6 BZM55C6V2 5.8 6.6 BZM55C6V8 6.4 7.2 BZM55C7V5 7 7.9 BZM55C8V2 7 ...

Page 3

... T 25 °C zmin j BZM55..Series Vishay Semiconductors Test Reverse Leakage Current Current amb amb 25°C 150°C µA mA max -0.06 1 < 50 < ...

Page 4

... BZM55..Series Vishay Semiconductors Typical Characteristics (T 600 500 400 300 200 100 120 160 T – Ambient T emperature(° 9602 amb Figure 1. Total Power Dissipation vs. Ambient Temperature 1000 T =25°C j 100 I =5mA – Z-Voltage ( 9598 Z Figure 2. Typical Change of Working Voltage under Operating Conditions at T =25° ...

Page 5

... Rev. 7, 10-Jun-03 0.152 Figure 10. Board for R Reflow Soldering 1.2 35 Figure 11. Recommended foot pads (in mm) Wave Soldering 1.4 25 Figure 12. Recommended foot pads (in mm) BZM55..Series Vishay Semiconductors 0.71 1.3 1.27 9.9 0.355 definition (in mm) thJA 0.8 0.8 0.8 2.4 0.9 1.0 0.9 2 ...

Page 6

... BZM55..Series Vishay Semiconductors 1000 t /T=0.5 p 100 t /T=0 /T=0. /T=0.1 t /T=0. /T=0. – 9603 Package Dimensions in mm www.vishay.com 6 Single Pulse R =300K/W thJA T=T jmax 2 1 =(–V +(V +4r T thp – Pulse Length ( Figure 13. Thermal Response 96 12072 VISHAY –T amb )/( Document Number 85597 ...

Page 7

... Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 ...

Page 8

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components. ...

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