BZT52C27-TP Micro Commercial Components (MCC), BZT52C27-TP Datasheet

BZT52C27-TP

Manufacturer Part Number

BZT52C27-TP

Description

500mW, 27V Zener, SOD-123 / 7" REEL

Manufacturer

Micro Commercial Components (MCC)

Datasheets

1.BZT52C5V1-TP.pdf (4 pages)

2.BZT52C39-TP.pdf (3 pages)

Specifications of BZT52C27-TP

Voltage - Zener (nom) (vz)

27V

Voltage - Forward (vf) (max) @ If

900mV @ 10mA

Current - Reverse Leakage @ Vr

100nA @ 18.9V

Power - Max

500mW

Impedance (max) (zzt)

80 Ohm

Mounting Type

Surface Mount

Package / Case

SOD-123

Operating Temperature

-65°C ~ 175°C

Zener Voltage

27 V

Voltage Tolerance

5 %

Voltage Temperature Coefficient

23.35 mV / C

Power Dissipation

500 mW

Maximum Reverse Leakage Current

0.1 uA

Maximum Zener Impedance

80 Ohms

Maximum Operating Temperature

+ 175 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 65 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Tolerance

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current page: 1 of 3
Download datasheet (112Kb)

Revision: 8

Micro Commercial Components

Features

* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with

pad areas 25

Absolute Maximum Ratings

Electrical Characteristics

Absolute Maximum Ratings

Symbol

M C C

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose Medium Current

Ideally Suited for Automated Assembly Processes

Case Material: Molded Plastic. UL Flammability

designates RoHS Compliant. See ordering information)

Classification Rating 94V-0 and MSL Rating 1

Lead Free Finish/RoHS Compliant("P" Suffix

STG

thJA

Thermal Resistance Junction to

Ambient*

Maximum Forward Voltage

Power dissipation

Junction Temperature

Storage Temperature Range

=10mAdc)

Rating

www.mccsemi.com

omponents

20736 Marilla Street Chatsworth

!"#

$ % !"#

-65 to +175

Rating

305

500

0.9

1 of 3

Unit

DIM

.140

.100

.055

-----

.012

.006

-----

2.4 to 39 Volts

MIN

BZT52C2V4

Zener Diode

INCHES

BZT52C39

SUGGESTED SOLDER

SOD123

500 mW

PAD LAYOUT

THRU

MAX

0.048”

.152

.112

.071

.053

.031

-----

.006

.01

DIMENSIONS

0.093"

3.55

2.55

1.40

-----

0.30

0.15

-----

MIN

MAX

3.85

2.85

1.80

1.35

-----

.78

.25

.15

0.036”

2008/01/30

NOTE

Related parts for BZT52C27-TP

BZT52C27-TP Summary of contents

Page 1

Micro Commercial Components Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Processes Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 Lead ...

Page 2

... BZT52C16 15.3 16 17.1 BZT52C18 16.8 18 19.1 BZT52C20 18.8 20 21.2 BZT52C22 20.8 22 23.3 BZT52C24 22.8 24 25.6 BZT52C27 25.1 27 28.9 BZT52C30 28 30 BZT52C33 31 33 BZT52C36 34 36 BZT52C39 37 39 (1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm (2) f=1KHz www.mccsemi.com Revision: 8 Maximum Zener ...

Page 3

Micro Commercial Components Ordering Information Device (Part Number)-TP Micro Commercial Components Corp product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp use of any product described ...

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