HSMS-282B-TR1 Avago Technologies US Inc., HSMS-282B-TR1 Datasheet - Page 5

• Manufacturer Part Number: HSMS-282B-TR1
• Description: Diode
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-282B-TR1

• Series Resistance @ If: 12ohm
• Peak Reflow Compatible (260 C): No
• Reel Quantity: 3000
• Pin Configuration: Single
• Breakdown Voltage Min: 15V
• Leaded Process Compatible: No
• Forward Voltage: 340mV
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Applications Information Introduction —
Product Selection
Avago’s family of Schottky products provides unique solu‑
tions to many design problems.
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS‑280x family
use the same diode chip, and the same is true of the HSMS‑
281x and HSMS‑282x families. Each family has a different
set of characteristics which can be compared most easily
by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (R
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), offering
lower 1/f or flicker noise than the HSMS‑282x family.
In general, the HSMS‑282x family should be the designer’s
first choice, with the ‑280x family reserved for high volt‑
age applications and the HSMS‑281x family for low flicker
noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑323
(SC‑70) package is shown in Figure 6 (dimensions are in
inches). This layout provides ample allowance for package
placement by automated assembly equipment without
adding parasitics that could impair the performance.
Table 1. Typical SPICE Parameters
5
Parameter
B
C
E
I
I
N
R
P
P
M
BV
S
G
V
J0
S
B
T
(XTI)
(V
J
)
Units
V
pF
eV
A
A
Ω
V
HSMS-280x
75
1.6
0.69
1 E‑5
3 E‑8
1.08
30
0.65
2
0.5
s
). In applications which
HSMS-281x
25
1.1
0.69
1 E‑5
4.8 E‑9
1.08
10
0.65
2
0.5
HSMS-282x
15
0.7
0.69
1 E‑4
2.2 E‑8
1.08
6
0.65
2
0.5
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑363
(SC‑70, 6 lead) package is shown in Figure 7 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor‑
mance.
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.
0.039
0.039
0.026
0.026
Dimensions in inches
Dimensions in inches
0.018
0.022
0.079
0.079