SI8404DB-T1-E1 Vishay, SI8404DB-T1-E1 Datasheet
SI8404DB-T1-E1
Specifications of SI8404DB-T1-E1
Related parts for SI8404DB-T1-E1
SI8404DB-T1-E1 Summary of contents
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... On-Resistance Per Footprint Area 10.2 APPLICATIONS • Low Threshold Load Switch for Portable Devices - Low Power Consumption - Increased Battery Life Device Marking: 8404 xxx = Date/Lot Traceability Code Ordering Information: Si8404DB-T1-E1 (Lead (Pb)-free °C, unless otherwise noted A Symbol ° ° ...
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... Si8404DB Vishay Siliconix THERMAL RESISTANCE RATINGS Parameter a b Maximum Junction-to-Ambient Maximum Junction-to-Foot (Drain) Notes: a. Surface Mounted on 1" x 1" FR4 board. b. Maximum under steady state conditions is 72 °C/W. SPECIFICATIONS °C, unless otherwise noted J Parameter Symbol Static Drain-Source Breakdown Voltage ΔV V Temperature Coefficient DS Δ ...
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... Output Characteristics Document Number: 73518 S-82118-Rev. C, 08-Sep-08 Test Conditions ° dI/dt = 100 A/µ °C, unless otherwise noted 1.5 2.0 Si8404DB Vishay Siliconix Min. Typ. Max. 6.25 20 0.6 1.2 104 156 88 132 = 25 ° 125 ° ° 0.0 0.3 0.6 0.9 1 Gate-to-Source Voltage (V) ...
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... Si8404DB Vishay Siliconix TYPICAL CHARACTERISTICS T 0. Drain Current ( vs. Drain Current DS(on Total Gate Charge (nC) g Gate Charge 3000 2400 C iss 1800 1200 C oss 600 C rss Drain-to-Source Voltage (V) DS Capacitance www.vishay.com °C, unless otherwise noted ...
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... It is used to determine the current rating, when this rating falls below the package limit. Si8404DB Vishay Siliconix 100 Limited DS(on) 10 P(t) = 100 ms ...
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... Si8404DB Vishay Siliconix TYPICAL CHARACTERISTICS Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Normalized Thermal Transient Impedance, Junction-to-Foot www.vishay.com °C, unless otherwise noted ...
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... Diameter Millimeters Min. Max. 0.600 0.650 0.260 0.290 0.340 0.360 0.370 0.410 1.520 1.600 1.520 1.600 0.750 0.850 0.370 0.380 Si8404DB Vishay Siliconix Silicon Bump Note Inches Min. Max. 0.0236 0.0256 0.0102 0.0114 0.0134 0.0142 0.0146 0.0161 0.0598 0.0630 0.0598 0.0630 ...
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... PCB Design and Assembly Guidelines For MICRO FOOTr Products Johnson Zhao INTRODUCTION Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging (WL-CSP) technology that implements a solder bump process to eliminate the need for an outer package to encase the silicon die. MICRO FOOT products include power MOSFETs, analog switches, and power ICs ...
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... BOARD LAYOUT GUIDELINES Board materials. Vishay Siliconix MICRO FOOT products are designed to be reliable on most board types, including organic boards such as FR-4 or polyamide boards. The package qualification information is based on the test on 0.5-oz. FR-4 and polyamide boards with NSMD pad design ...
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... Use a vacuum needle pick-up tip to pick up the replacement part, and use a placement jig to placed it accurately. 6. Reflow the part using the same convection nozzle, and preheat from the bottom, matching the original reflow profile. Vishay Siliconix Thermal Profile 0 100 200 300 Time (Seconds FIGURE 6 ...
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... Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part ...