TFBS4711-TT1 Vishay, TFBS4711-TT1 Datasheet - Page 5
![IRDA TRANSCEIVER SIR SV-e4](/photos/40/16/401683/tfbs4711-tt1_sml.jpg)
TFBS4711-TT1
Manufacturer Part Number
TFBS4711-TT1
Description
IRDA TRANSCEIVER SIR SV-e4
Manufacturer
Vishay
Type
TX/RXr
Specifications of TFBS4711-TT1
Peak Wavelength
900nm
Angle Of Half Sensitivity
44°
Pulse Width
2us
Communication Distance
100
Led Supply Voltage
-0.5 to 6V
Package Type
SMD
Fall Time
100ns
Rise Time
100ns
Dimensions
6x3.1x1.9
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Supply Voltage (min)
2.4V
Operating Supply Voltage (max)
5.5V
Mounting
Surface Mount
Pin Count
6
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Data Rate
115.2Kbps
Idle Current, Typ @ 25° C
75µA
Link Range, Low Power
1m
Operating Temperature
-30°C ~ 85°C
Orientation
Top View
Shutdown
*
Size
6mm x 3.1mm x 1.9mm
Standards
IrPHY 1.2
Supply Voltage
2.7 V ~ 5.5 V
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TFBS4711-TT1
Manufacturer:
VISHAY/威世
Quantity:
20 000
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 2 is VISHAY's recommended profiles for use with
the TFBS4711 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 82633
Rev. 1.9, 07-Nov-06
260
240
220
200
180
160
140
120
100
80
60
40
20
Figure 1. Recommended Solder Profile for Sn/Pb soldering
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 2. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
200
50 s max.
20 s
TFBS4711
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
350
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