HLMP-4719-A00B2 Avago Technologies US Inc., HLMP-4719-A00B2 Datasheet - Page 9

LED, 5MM, RED, 2.3MCD, 585NM

HLMP-4719-A00B2

Manufacturer Part Number
HLMP-4719-A00B2
Description
LED, 5MM, RED, 2.3MCD, 585NM
Manufacturer
Avago Technologies US Inc.
Series
HLMP-4719r
Datasheet

Specifications of HLMP-4719-A00B2

Bulb Size
5mm
Led Color
Red
Luminous Intensity
2.3mcd
Viewing Angle
50°
Forward Current If
2mA
Forward Voltage
1.8V
Led Mounting
Through Hole
Lens Shape
Round
Wavelength Typ
585nm
Color
Yellow
Voltage Rating
1.8V
Current
2mA
Lens Type
Diffused, Yellow Tinted
Lens Style/size
Round, 5mm, T-1 3/4
Configuration
Single
Mounting Type
Through Hole, Right Angle
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-4719-A00B2
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HLMP-4719-A00B2
Manufacturer:
AVAGO
Quantity:
50 000
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
Example of Wave Soldering Temperature Profile for TH LED
9
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
250
(1P) Item: Part Number
(V) Vendor ID:
200
150
100
50
0
Lamps Baby Label
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
QUANTITY: Packing Quantity
RoHS Compliant
e3
max temp 250C
70
max temp 250C
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.

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