110214 NICHIA, 110214 Datasheet - Page 6

• Manufacturer Part Number: 110214
• Description: LED, RECT, 110DEG, GREEN
• Manufacturer: NICHIA

Specifications of 110214

• Bulb Size: 4mm X 2mm
• Led Colour: Green
• Luminous Intensity: 550mcd
• Viewing Angle: 110°
• Forward Voltage: 3.5V
• Led Mounting: Through Hole
• Lens Shape: Rectangular
• Svhc: No SVHC (18-Jun-2010)
• Dominant: RoHS Compliant
• Forward Current If: 30mA
• Rohs Compliant: Yes

(4) Soldering Conditions
(5) Heat Generation
(6) Cleaning
· Nichia LED leadframes are comprised of a silver plated copper alloy.
· Solder the LED no closer than 3mm from the base of the epoxy bulb.
· Recommended soldering conditions
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
· Direct soldering onto a PC board should be avoided.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
· Cut the LED leadframes at room temperature.
· Thermal design of the end product is of paramount importance.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
thermal coefficient (easily conducts heat).
of the tie bar is recommended.
the LEDs return to room temperature.
from warping of the PC board or from the clinching and cutting of the leadframes.
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
the mechanical stress on the LEDs.
cause failure of the LEDs.
of the LED when making the system design.
electric power is affected by the thermal resistance of the circuit board and density of LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
for any problems.
such as wire bond failure or resin deterioration, will occur.
Pre-Heat
Pre-Heat Time
Solder Bath
Dipping Time
Dipping Position
Temperature
Direct soldering should only be done after testing has confirmed that no damage,
Dip Soldering
120°C Max.
60 seconds Max.
260°C Max.
10 seconds Max.
No lower than 3 mm from the
base of the epoxy bulb.
Careful attention should be paid during soldering.
The coefficient of temperature increase per input
-5-
Cutting the leadframes at high temperatures may
Temperature
Soldering Time
Position
Mechanical stress to the resin may be caused
Nichia’s LEDs should not be soldered
Please consider the heat generation
350°C Max.
3 seconds Max.
No closer than 3 mm from the
base of the epoxy bulb.
Soldering
Soldering beyond the base
This substance has a low
Nichia STSE-CG2143B
When it is
<Cat.No.031212>