FOD617C Fairchild Semiconductor, FOD617C Datasheet
FOD617C
Specifications of FOD617C
Related parts for FOD617C
FOD617C Summary of contents
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... Applicable to Pb-free IR reflow soldering ■ Compact 4-pin package ■ Current transfer ratio in selected groups: FOD617A: 40–80% FOD817: 50–600% FOD617B: 63–125% FOD817A:80–160% FOD617C: 100–200% FOD817B: 130–260% FOD617D: 160–320% FOD817C:200–400% FOD814: 20–300% FOD817D:300–600% FOD814A: 50–150% ■ C-UL, UL and VDE approved ■ ...
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Absolute Maximum Ratings Symbol Parameter TOTAL DEVICE T Storage Temperature STG T Operating Temperature OPR T Lead Solder Temperature SOL P Total Power Dissipation TOT EMITTER I Continuous Forward Current F V Reverse Voltage R P Power Dissipation D Derate ...
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... I = 10µ 25°C Unless otherwise specified.) Device Test Conditions (1) FOD814 I = ±1mA FOD814A (1) FOD617A I = 10mA FOD617B FOD617C FOD617D (1) FOD617A I = 1mA FOD617B FOD617C FOD617D (1) FOD817 I = 5mA FOD817A FOD817B FOD817C FOD817D FOD814 I = ±20mA 1mA F C FOD617 I = 10mA 2.5mA F C FOD817 I = 20mA 1mA Min. ...
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Transfer Characteristics (Continued) (T Symbol AC Characteristic f Cut-Off Frequency C t Response Time (Rise Response Time (Fall) f Isolation Characteristics Symbol Characteristic V Input-Output Isolation ISO (3) Voltage R Isolation Resistance ISO C Isolation Capacitance ISO *Typical ...
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Typical Electrical/Optical Characteristics Fig. 1 Collector Power Dissipation vs. Ambient Temperature (FOD814) 200 150 100 50 0 -55 -40 - 100 120 AMBIENT TEMPERATURE T Fig. 3 Collector-Emitter Saturation Voltage vs. Forward Current 6 Ic ...
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Typical Electrical/Optical Characteristics Fig. 7 Collector Current vs. Collector-Emitter Voltage (FOD814 30m AX.) 30 10m ...
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Typical Electrical/Optical Characteristics Fig. 13 Response Time vs. Load Resistance 100 Ic= 2mA Ta = 25° 0.5 0.2 0.1 0.1 0.2 0.5 1 LOAD RESISTANCE R L ...
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Package Dimensions (Through Hole) 0.200 (5.10) 0.161 (4.10) 0.157 (4.00) 0.118 (3.00) 0.130 (3.30) 0.020 (0.51) 0.091 (2.30) TYP 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) Package Dimensions (0.4” Lead Spacing) 0.200 (5.10) 0.157 (4.00) ...
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Ordering Information Option Part Number Example S FOD814S SD FOD814SD W FOD814W 300 FOD814300 300W FOD814300W 3S FOD8143S 3SD FOD8143SD Marking Information Definitions FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5 VDE Approved, 0.4" ...
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Carrier Tape Specifications Ø1.55±0.05 Note: All dimensions are in millimeters. Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0 Symbol ...
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Lead Free Recommended IR Reflow Condition Tp Tsmax Tsmin 25°C Profile Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Recommended Wave Soldering condition Profile Feature Peak temperature (Tp) FOD814 Series, FOD617 Series, FOD817 Series ...
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... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ® ACEx™ FAST ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ ...