VLMT3100-GS08 Vishay, VLMT3100-GS08 Datasheet - Page 5

• Manufacturer Part Number: VLMT3100-GS08
• Description: Surface-Mount/Axial LED Lamp,Orange-Red,Clear,LED-8d
• Manufacturer: Vishay
• Type: Uni-Colorr

Specifications of VLMT3100-GS08

• Led Size: 3 mm x 2.8 mm
• Illumination Color: Red
• Operating Voltage: 2.2 V
• Wavelength: 612 nm to 625 nm
• Luminous Intensity: 1.1 mcd
• Mounting Style: SMD/SMT
• Operating Current: 2 mA
• Lens Dimensions: 2.4 mm
• Lens Shape: Flat Round
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 635 nm
• Package / Case: PLCC-2
• Viewing Angle: 60 deg
• Package Type: SMD
• Emitting Color: Red
• Test Current (it): 2mA
• Forward Current: 7mA
• Dominant Wave Length: 625nm
• Forward Voltage: 2.9V
• Product Length (mm): 3mm
• Product Depth (mm): 2.8mm
• Mounting: Surface Mount
• Shape Type: Circular
• Chip Material: GaAsP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Lens Type: Non Diffused
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 15V
• Power Dissipation: 20mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERING PROFILE
BAR CODE PRODUCT LABEL
EXAMPLE:
A) Type of componenent
B) Manufacturing plant
C) SEL - Selection code (Bin):
D) Date code year/week
E) Day code (e.g. 1: Monday)
F) Batch no.
G) Total quantity
H) Company code
Document Number 81710
Rev. 1.2, 15-Mar-11
Figure 12. Double Wave Soldering of Opto Devices (all Packages)
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile
e.g.: J1 = code for luminous intensity group
300
250
200
150
100
B C
50
19885
0
948626-1
0
3 = code for color group
255 °C
240 °C
217 °C
100
300
250
200
150
50
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
max. ramp up 3 °C/s
0
0
first wave
50
D
ca. 200 K/s
100 °C
to 130 °C
A
Preconditioning acc. to JEDEC level 2a
235 °C
to 260 °C
TTW Soldering (acc. to CECC00802)
max. 120 s
E
(acc. to J-STD-020)
50
forced cooling
5 s
100
2 K/s
F
106
100
Time (s)
Time (s)
second
wave
150
dotted line: process limits
ca. 2 K/s
150
max. ramp down 6 °C/s
full line: typical
lead temperature
max. 100 s
200
ca. 5 K/s
max. 30 s
max. 2 cycles allowed
200
VISHAY
For technical support, please contact:
G
max. 260 °C
250
This datasheet is subject to change without notice.
H
245 °C
250
20126
37
300
DRY PACKING
The reel is packed in an anti-humidity bag to protect
the
transportation and storage.
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminum bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity  60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH
(dry air/nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label
is included on all dry bags.
[e-mail]
devices
15973
Aluminum bag
from
Reel
Vishay Semiconductors
absorbing
www.vishay.com/doc?91000
VLMT3100
moisture
Label
www.vishay.com
during
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