XPEHEW-H1-0000-00CE6 Cree Inc, XPEHEW-H1-0000-00CE6 Datasheet - Page 7

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XPEHEW-H1-0000-00CE6

Manufacturer Part Number
XPEHEW-H1-0000-00CE6
Description
XPE Series High Efficiency White
Manufacturer
Cree Inc
Datasheet

Specifications of XPEHEW-H1-0000-00CE6

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XP-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
Profile Feature
Average Ramp-Up Rate (Ts
Preheat: Temperature Min (Ts
Preheat: Temperature Max (Ts
Preheat: Time (ts
Time Maintained Above: Temperature (T
Time Maintained Above: Time (t
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
min
to ts
max
max
)
min
to Tp)
max
)
L
)
)
L
)
XLAMP XP-E HIGH-EFFICIENCY WHITE LEDS
Lead-Based Solder
3°C/second max.
6°C/second max.
60-120 seconds
60-150 seconds
6 minutes max.
10-30 seconds
100°C
150°C
183°C
215°C
Lead-Free Solder
3°C/second max.
6°C/second max
60-180 seconds
60-150 seconds
8 minutes max.
20-40 seconds
150°C
200°C
217°C
260°C
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