760-236563B VERO, 760-236563B Datasheet - Page 2
![CASE, 3U, 422MM](/photos/23/2/230264/42246205_sml.jpg)
760-236563B
Manufacturer Part Number
760-236563B
Description
CASE, 3U, 422MM
Manufacturer
VERO
Datasheet
1.60-39268L.pdf
(12 pages)
Specifications of 760-236563B
Svhc
No SVHC (15-Dec-2010)
Approval Bodies
IEC297-1, DIN41494
Coating
Zintec
Colour
Light Grey
External Depth
422mm
External Width
530mm
Internal Depth - Metric
377mm
Internal Width - Metric
471mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
4
DIPLOMAT Case Cooling
NEW AND IMPROVED COOLING PERFORMANCE
The DIPLOMAT range of enclosures has improved cooling performance in both
the standard and fan plinth versions. The fan plinth version has a wider plinth
with an increased ventilation surface area to increase the volume of air flow. The
plinth can either act as a chamber for air collection when fans are mounted on
the rear panel of the unit (pull through air flow) or can be used to mount fans
directly hence employing a push method of cooling. Fans can be mounted in the
plinth and on the rear panel employing a push-pull method of cooling.
Ducting plates can be placed in the plinth to give additional direction to the
air flow, concentrating the flow towards hot cards or components. The level
of cooling performance achieved will depend on a number of variables, such
as the internal component architecture and hot component positioning. A test
was set up where a 6U DIPLOMAT unit 19" wide was fitted with a populated
card frame, 220mm boards to a 6U full width backplane, and air flow indicating
componentry. Two 95CFM fans were mounted on the rear panel and a standard
ducting plate used to direct the air across the cards, the results recorded are
shown below.
The results below were measurements of air velocity taken from the standard
DIPLOMAT with new 38mm deep plinth with ducting plate, and 2 x 95 CFM fans
mounted on the rear panel. The top panel was non ventilated.
DIPLOMAT Case
Air flow
Velocity M/S
DIPLOMAT Airflow Velocities
Velocity m/s
2 x 95CFM Rear Panel (New Style Plinth)
PCB Card Position (HP)
HP Position
Rear
of PCB
Top
Side Elevation PCB
Middle
Card Postion
Bottom
Card Guide
Position
Top