262-75ABE01 Wakefield Thermal Solutions, 262-75ABE01 Datasheet - Page 15

• Manufacturer Part Number: 262-75ABE01
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE01

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 13.46mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-01; 26275AB01; 345-1084

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Dimensions: in. (mm)
Dimensions: in. (mm)
36
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Board Level
Heat Sinks
6/14/07
Standard
P/N
286-AB
286-CBTE
286-CTE
Efficient heat removal at low cost can be achieved by inserting the 286 Series di-
rectly into pre-drilled circuit boards; scored mounting tabs may be bent after in-
sertion to provide added stability. The 286 Series can be wavesoldered directly to
Mounting Slot
287-1ABE
287-2ABE
Material: Aluminum, Black Anodized
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed
circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the
Standard
P/N
285 SC
330 SC
SpeedClips™ employ a locking safety tab for mounting. Must be ordered sepa-
rately for these heat sink series. Use these SpeedClips™ with our 237, 240, and
252 Series heat sinks for the lowest production assembly time and cost. Order
286 SERIES
287 SERIES
285 & 330 SERIES
10:55 AM
Standard P/N
Height Above
1.190 (30.2)
1.190 (30.2)
1.190 (30.2)
PC Board
in. (mm)
Mounting Hole
287-1ABH
287-2ABH
Page 36
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
See also 286DB Series on Page 7.
Wave-Solderable Low-Cost Heat Sinks
Nominal Installed
Loading Force
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
285 SC and 330 SC SpeedClips™
Maximum Footprint
10 lbs
4 lbs
Height Above
1.180 (30.0)
1.180 (30.0)
in. (mm)
PC Board
in. (mm)
286 SERIES
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
Nominal Force
4 lb (17.8N)
232, 237, 240, 252, 667
232, 237, 240, 252, 667
Aluminum, Anodized
Installed
330 SC
Speed
Footprint “A”
Clip
Maximum
Copper, Tinned
Copper, Black
in. (mm)
287 SERIES
With Series
Material
For Use
Standard P/N
287-1AB
287-2AB
287-1ABH
287-2ABH
the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style
(copper, black paint tin tabs), and 286-CT style (copper, tinned).
board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-
220 and similar semiconductor packages.
one SpeedClip™ for each heat sink purchased. Must be purchased with heat
sinks.
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
Dim. “A”
58°C @ 4W
58°C @ 4W
58°C @ 4W
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
65°C @ 4W
55°C @ 4W
Convection
Natural
Stainless Steel
Carbon Steel
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Material
NATURAL AND FORCED
NATURAL AND FORCED
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
Convection
Convection
Forced
Forced
Nominal Force
10 lb (44.5N)
0.00053 (0.24)
0.00074 (0.34)
lbs. (grams)
Installed
285 SC
Speed
Weight
Clip
0.0250 (11.34)
0.0250 (11.34)
0.0090 (4.08)
0.0140 (6.35)
Zif Socket 8 And
lbs. (grams)
0.0085 (3.86)
lbs. (grams)
387 SPGA LIF
Weight
Weight
TO-220
TO-220