658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 4

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
PRODUCT FEATURES
14
12
10
8
6
4
2
0
Performance shown is with T4 thermal adhesive applied.
200
300
Approach Velocity, LFM
400
642-25-T4
642-35-T4
642-45-T4
642-60-T4
500
600