EZBEE RF Solutions, EZBEE Datasheet - Page 5

• Manufacturer Part Number: EZBEE
• Description: MODULE, ZIGBEE, EZBEE
• Manufacturer: RF Solutions

Specifications of EZBEE

• Svhc: No SVHC (15-Dec-2010)

It is recommended that tracks and components are not
placed in PCB layers below the module. However, if
space limitations require it, leave the surface in contact
with the module uncoppered and place a grounded fill in
the layer immediately below. Any vias that might come
in contact with the module should be completely
covered with resist to avoid shorting to vias on the
module.
The main board should contain as much
grounded copper fill as possible in order to reduce
circuit noise.
Enclosures
Metal enclosures are not recommended for attenuation
reasons. If one must be used, aim to put as many holes
in it as possible at least 3cm long.
For mains isolation and intrinsic safety applications,
potting in a shallow layer of clear potting compound is
recommended. A 5mm layer of potting compound (RS
Components p/n 199-1468) has been measured to
attenuate the signal by approximately 3dB. LEDs can
be clearly seen through the potting compound and bind
switches, etc, can be implemented using reed switches.
For all-weather and external mounting applications,
contact us for a range of puck antenna enclosures.
Bibliography
CC2420 Data Sheet, downloadable from
www.chipcon.com.
ZigBee for Applications Developers, white paper
downloadable from www.flexipanel.com.
Pixie Data Sheet, downloadable from
www.flexipanel.com.
PICDEM Z User Guide, downloadable from
www.microchip.com.
AN965 Microchip Stack for the ZigBee Protocol,
application note, downloadable from
www.microchip.com.
Microchip Stack for ZigBee Protocol, supplementary
notes included with the Microchip Stack for ZigBee
firmware downloadable from www.microchip.com.
p5
20-Sep-06
EasyBee DS480-11
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Patents may apply and/or pending
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