ABM3B-12.1875MHZ-10-D4 Abracon Corporation, ABM3B-12.1875MHZ-10-D4 Datasheet - Page 5

• Manufacturer Part Number: ABM3B-12.1875MHZ-10-D4
• Description: CRYSTAL,12.1875MHz,10pF,5mm X 3.2mm SMD
• Manufacturer: Abracon Corporation
• Series: ABM3Br
• Type: MHz Crystalr

Specifications of ABM3B-12.1875MHZ-10-D4

• Operating Temperature Range: -40°C To +85°C
• Crystal Mounting Type: SMD
• No. Of Pins: 4
• Frequency: 12.1875MHz
• Frequency Tolerance: ± 30ppm
• Load Capacitance: 10pF
• Frequency Stability: 50ppm
• Operating Mode: Fundamental
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead (DFN, LCC)
• Size / Dimension: 0.197" L x 0.130" W (5.00mm x 3.30mm)
• Height: 0.043" (1.10mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 535-9698-2

6.0 RELIABILITY TEST
6.1 REFLOW PROFILE
The Power Of Linking Together
No.
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ABRACON
CORPORATION
Temperature Cycling:
Gross Leak Test:
Fine Leak Test:
Thermal Shock:
Solderability:
Test Items
(ABLS only)
Lead Bend:
Drop Test:
Vibration:
Humidity:
Drawing No. :
The component shall remain within the electrical specification (± 5 pp
max) after 3 cycles of high and low temperature testing (-40°C to
+85°C) for 2 hours max.
The component shall remain within the electrical specification after
exposure at extreme temperature -40°C to +85°C for 5 minutes for 3
cycles.
The component shall remain within the electrical specification after
loaded vibration at 10Hz to 55Hz, amplitude 1.5mm, within 1 minute
for 2 hours minimum on each axis (X,Y,Z).
The component shall remain within the electrical specifications after a
natural drop (3X) on a hard wooden board at 75 cm.
The component shall remain within the electrical specifications after
being kept at a condition of ambient temperature +85°C, 85% RH for
96 hours minimum.
Expose samples to 60PSIG Helium gas for 2 hours.
Max leak rate 2X10-8atmcc/s.
Submerge samples in 100% De-ionized water or Perfluorocarbon at
85°C for at least 1 minute. Check for bubbles.
Solderability of terminals shall be kept at more than 95% after dipped
in solder flux at 260°C ± 5°C for 5 seconds.
The component shall withstand maximum bend of 90°C
reference to base for 2 bends. Solder tinning must be
4 microns thick minimum.
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Test Conditions
Rev. -
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