233-60AB Wakefield Thermal Solutions, 233-60AB Datasheet

Heat Sink

233-60AB

Manufacturer Part Number
233-60AB
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Series
233r
Datasheets

Specifications of 233-60AB

Packages Cooled
TO-220
Thermal Resistance
58°C/W
Heat Sink Material
Aluminum
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On
Outline
14.48mm x 12.70mm
Height
0.600" (15.20mm)
Power Dissipation @ Temperature Rise
2W @ 58°C
Thermal Resistance @ Forced Air Flow
11.0°C/W @ 400 LFM
Thermal Resistance @ Natural
29°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 12.7 mm W x 19.05 mm H
Designed For
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1014

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
233-60AB
Manufacturer:
WAK
Quantity:
1 615
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CTE6
217-36CTTE6
217-36CTRE6
Material: Copper, Matte Tin Plated
22
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
6/14/07
217-36CT6
Height Above
.360 (9.1)
.360 (9.1)
.360 (9.1)
PC Board
in. (mm)
10:54 AM
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Page 22
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Bulk
Tube
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
Device Power Dissipation. W
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D ' PAK
Device + HS, 100 lfm
Convection
55°C @ 1W
55°C @ 1W
55°C @ 1W
Natural
Thermal Performance at Typical Load
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Device + HS, 300 lfm
Forced

Related parts for 233-60AB

233-60AB Summary of contents

Page 1

WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) 217-36CTTE6 .360 (9.1) .600 ...

Page 2

... Solid line = 218-40CT5 218-40CT5 Board Level Heat Sinks D 2 PAK, TO-220, SOL-20 217-36CT6 SMT Devices Thermal Performance at Typical Load Natural Convection Forced Convection 62°C rise @ 2W 21°C/W @ 200LFM 62°C rise @ 2W 21°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 ...

Page 3

... Horizontal 05 230-75AB-05 230-75AB-10 230 AND 234 SERIES 234 SERIES 234-75AB-05 TO-220 Thermal Performance at Typical Load Natural Convection Forced Convection 56°C rise @ 4W 7.3°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 200 400 600 800 1000 ...

Page 4

... HEAT DISSIPATED (WATTS) TO-220 Thermal Performance at Typical Load Natural Convection Forced Convection 80°C rise @ 2W 10°C/W @ 200LFM 80°C rise @ 2W 10°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 ...

Page 5

... Vertical 10 .570 (14.5) x .500 (12.7) Vert./Horiz No Tab .570 (14.5) x .500 (12.7) Vertical 01 Horizontal 05 .570 (14.5) x .570 (12.7) Vetrical 10 233-60AB-01 233-60AB-10 236-150AB-01 236-150AB-10 Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Footprint PC Board Dimensions Mounting Solderable in. (mm) in. (mm) Configuration Tab Options .750 (19.1) ...

Page 6

WTS001_p26-49 6/14/07 10:55 AM Page 27 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Height Above Standard P/N 235-85AB 235-85ABE-01 235-85ABE-05 235-85ABE-10 PATENT 5381041 Material: Aluminum, Black Anodized 235-85AB-05 243 SERIES Height Above Standard P/N 243-1PAB 243-3PAB Material: Aluminum, Pre-anodized ...

Page 7

... AIR VELOCITY (LFM) 200 400 600 800 1000 200 400 600 800 1000 HEAT DISSIPATED (WATTS) TO-220 Thermal Performance at Typical Load Natural Convection Forced Convection 65°C rise @ 4W 9.0°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 ...

Page 8

WTS001_p26-49 6/14/07 10:55 AM Page 29 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Height Above Standard P/N 273-AB 273-ABE-01 273-ABE-02 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 273-AB 274 & 281 SERIES Height Above Standard P/N 274-1AB 274-1ABE-01 274-1ABE-02 274-2AB ...

Page 9

WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks 242 SERIES Height Above Standard PC Board P/N in. (mm) 242-125ABE-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 ...

Page 10

WTS001_p26-49 6/14/07 10:55 AM Page 31 BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Standard P/N 244-145AB 244-145ABE-50 1.650 (41.9) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N 245-145AB 245-145ABE-50 1.650 (41.9) ...

Page 11

WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks 247 SERIES Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 ...

Page 12

WTS001_p26-49 6/14/07 10:55 AM Page 33 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Standard P/N 288-1ABE Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconduc- tor packages. ...

Page 13

WTS001_p26-49 6/14/07 10:55 AM Page 34 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Height Above Standard PC Board P/N in. (mm) 270-AB 0.375 (9.4) 272-AB 0.375 (9.4) 280-AB 0.375 (9.4) Material: Aluminum, Black Anodized These ...

Page 14

WTS001_p26-49 6/14/07 10:55 AM Page 35 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES Standard P/N 250-122AB 250-122ABE-09 250-122ABE-25 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 250-122AB Dimensions: in. (mm) 237 & 252 SERIES Standard P/N 237-167AB2 237-167AB3 237-167ABE2-24 1.675 (42.5) ...

Page 15

WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks 286 SERIES See also 286DB Series on Page 7. Height Above Standard PC Board P/N in. (mm) ...

Page 16

WTS001_p26-49 6/14/07 10:55 AM Page 37 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with ...

Page 17

... Overall Fin Width Thermal Performance in. (mm) Natural Convection 0. 600 (15.3) 0.225°C/W @ 0.250 W 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized 292 SERIES ...

Page 18

WTS001_p26-49 6/14/07 10:56 AM Page 39 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Standard Plain Pin 634-10ABEP 634-15ABEP 634-20ABEP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- cally mounting ...

Page 19

WTS001_p26-49 6/14/07 10:56 AM Page 40 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting 667 SERIES Standard P/N Standoff Pin Plain Pin 667-10ABESP 667-10ABPP 667-15ABESP 667-15ABPP 667-20ABESP 667-20ABPP 667-25ABESP 667-25ABPP ...

Page 20

WTS001_p26-49 6/14/07 10:56 AM Page 41 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 647 SERIES Standard P/N 647-1OABEP 647-15ABEP 647-175ABEP 647-20ABEP 647-25ABEP Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit ...

Page 21

WTS001_p26-49 6/14/07 10:56 AM Page 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Notched Heat Sinks for Vertical Board Mounting 657 SERIES Standard P/N 657-10ABEPN 657-15ABEPN 657-20ABEPN 657-25ABEPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...

Page 22

... These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). 680 SERIES SEMICONDUCTOR MOUNTING HOLES A 220 TO-3 *TWO TO-220’ ...

Page 23

... Use these low-height heat sinks on printed circuit board applications for TO-66 power semi- conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat MECHANICAL DIMENSIONS 601 SERIES (EXTRUSION PROFILE 1284) Dimensions: in. (mm) Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors 641 SERIES Outline Standard Dimensions P/N in ...

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