627-10ABP Wakefield Thermal Solutions, 627-10ABP Datasheet - Page 13
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627-10ABP
Manufacturer Part Number
627-10ABP
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.217-36CT6.pdf
(20 pages)
Specifications of 627-10ABP
Packages Cooled
TO-218 / TO-220
Thermal Resistance
76°C/W
Width
12.7mm
Height
25.4mm
Heat Sink Material
Aluminum
Peak Reflow Compatible (260 C)
No
Length
34.9mm
Leaded Process Compatible
No
Mounting Type
Screw
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
260 SERIES
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide
Base Mounting Configurations — TO-5
Plain Ty p e — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care
should be taken not to use too long a screw, which could short against the
semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not
supplied. Stud hole must be slightly countersunk to ensure flat mounting.
Epoxy Insulated For TO-5
All other products, please contact factory for price, delivery, and minimums.
Thermal Resistance – Epoxy Insulated
Thermal Resistance – Beryllium Oxide Insulated
260-6SH5E
Characteristics
Breakdown Voltage – Epoxy Type (VAC), 60 Hz
Breakdown Voltage – Beryllium Type (VAC), 60 Hz
Recommended Operating Voltage, AC or DC
Temperature Range — Continuous (C°)
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE
Standard
P/N
260-4T5E
260-4TH5E
260-1OSH5E
260-4TH5B
260-6SH5B
260-10SH5B
Board Level
Heat Sinks
Clean Conditions: % Hipot Rating
Dusty Conditions: % Hipot Rating
Dirty Conditions: % Hipot Rating
260-4T5E
Cup Clips for TO-5 Case Style Semiconductors
Beryllium Oxide Insulated
Beryllium Oxide Insulated
Beryllium Oxide Insulated
Epoxy Insulated
Epoxy Insulatad
Epoxy Insulated
Epoxy Insulated
P/N
256 SERIES
Standard
256-DM
Insulation
Type
Thermal Retainers
260-4TH5E
Mounting Tab)
Height (Less
0.190 (4.0)
in. (mm)
0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)
-73/+149
16° C/W
10 to 20
14° C/W
TO-5
1000
500
50
30
Outline Dimension
L x W x I.D.
T h r e a d
S i z e :
M o u n t i n g
S t y l e :
in. (mm)
Model
260-4T5E
260-4TH5E
260-4TH5B
Beryllium Copper
Material
10 = #10-32 UNF
4 = #4-40 UNC
6 = #6-32 UNC
T = t a p p e d
S = s t u d
P = p l a i n
260-10SH5E
260-6SH5E
Tapped Base
0.093 (2.36)
0.125 (3.18)
0.125 (3.18)
Depth of
42
0.0005 (0.23)
lbs. (grams)
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) =
0.0024 (1.09)
0.0042 (1.91)
0.0039 (1.77)
0.0043 (1.95)
0.0031 (1.41)
0.0037 (1.68)
0.0042 (1.91)
Weight
lbs. (grams)
S e m i c o n d u c t o r
Weight
Beryllium Oxide Insulated For TO-5
Base Style: H = h e x
Case Style: 5 = T O - 5
I n s u l a t i o n E = e p o x y
Ty p e : B = b e ry l l i u m
Case
Style
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
260-4TH5B
Depth of Base + Panel Thickness + Washer Thickness
256-DM
260-10SH5B
260-6SH5B
Normally stocked
TO-92
TO-5