627-20ABEP Wakefield Thermal Solutions, 627-20ABEP Datasheet - Page 14

• Manufacturer Part Number: 627-20ABEP
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions
• Series: 627r

Specifications of 627-20ABEP

• Packages Cooled: TO-218 / TO-220
• Thermal Resistance: 9.17°C/W
• Width: 34.9mm
• Height: 50.8mm
• Heat Sink Material: Aluminum
• Length: 12.7mm
• Mounting Type: PC Board Through Hole
• Package / Case: TO-218, TO-220
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Single-Level Star
201, 202,204,205, 211 Series
Available
Standard P/N
Types
202CB
203CB
204CB
205CB
205AB, 205AP
207CB
207AB
209CB, 209SB
213CB, 213SB
215CB, 215AB
215AP
The thermal resistance from diode leads to chassis
or heat sink is 12°C/watt, when unit is mounted
with TYPE 120 Joint Compound. If a 10°C/watt
chassis or sink to ambient impedance is available,
the thermal resistance from the diode leads to
ambient is reduced from about 150°C/watt to
Power semiconductors packaged in a TO-92 style
plastic case can be cooled effectively at little addi-
tional cost with the addition of the 292-AB heat
sink. The 292-AB is effective over the typical power
Anodized.
& Finish
211CB
213AB, 213AP
22°C/watt.
range of such devices. Material: Aluminum, Black
201CB, 201AB
Normally stocked
, 205SB
, 207SB
, 204SB
, 207AP
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.161 (4.1)/0.240 (6.1)
0.161 (4.1)/0.240 (6.1)
0.275 (7.0)/0.370 (9.4)
0,275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0.161 (4.1)/0.240 (6.1)
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
Semiconductor
Case Diameter
200 SERIES
258 SERIES
Standard
P/N
258
292 SERIES
Standard
P/N
292-AB
Min/Max
in. (mm)
0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)
High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors
Thermal Links for Fused Glass Diodes
Heat Sink for Single TO-92
Height Above
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.750 (19.1)
Inside Dia.
0.150 (3.8)
0.150 (3.8)
0.150 (3.8)
0.255 (6.5)
0.255 (6.5)
0.255 (6.5)
0.255 (6,5)
0.255 (6.5)
0.255 (6.5)
Heat Sink
PC Board
in. (mm)
in. (mm)
MECHANICAL
DIMENSIONS
“A”
Dimensions
in. (mm)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dual-Level Star
203,207,213 Series
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Outside Dia.
0.640 (16.2)
0.490 (12.5)
0.640 (16.2)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
1.280 (32.5)
0.830 (21.1)
0.830 (21.1)
0.830 (21.1)
1.400 (35.6)
1.400 (35.6)
258 SERIES
0.550 (4.8)
Heat Sink
in. (mm)
“B”
0. 600 (15.3)
Fin Width
in. (mm)
Overall
0.437 (11.1)
0.437 (11.1)
0.437 (11.1)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
0.187 (4.8)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
Heat Sink
in. (mm)
Height
“C”
43
Aluminum
Material
Above Ambient ( CA@200 LFM)
73°C @ 1W
68°C @ 1W
59°C @ 1W
53°C @ 1W
30°C @ 1W
44°C @ 1W
51°C @ 1W
Convection
65°C @ 1W
53°C @ 1W
68°C @ 1W
46°C @ 1W
50°C @ 1W
28°C @ 1W
32°C @ 1W
Case Rise
Natural
Thermal Performance
0.225° C/W @ 0.250 W
Natural Convection
All other products, please contact factory for price, delivery, and minimums.
Dimensions: in. (mm)
DeltaCoate™ 151 on all surfaces
except solder pads and base
Convection
31°C/W
43°C/W
23°C/W
35°C/W
28°C/W
28°C/W
20°C/W
20°C/W
13°C/W
24°C/W
19°C/W
19°C/W
15°C/W
15°C/W
Forced
292 SERIES
Dual-Level Sunburst
209, 215 Series
Finish
TO-18, TO-24, TO-28,
TO-12, TO-26, TO-29,
TO-33, TO-43, TO-45
TO-5, TO-9, TO-11,
Semiconductor
TO-40, TO-44
TO-8, TO-38
Case Types
Applicable
Black Anodized
Power
Finish
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
0.0018 (0.82)
lbs. (grams)
Materials and
Finishes Available
for 200 Series:
CB
SB
AB
AP
Weight
Board Level
Heat Sinks
0.00049 (0.22)
Beryllium cop-
per; black ebonol
"C" Finish
Silver-bearing
copper; black
ebonol "C"
Aluminum, black
anodized
Aluminum, no
finish applied
lbs. (grams)
Weight
DIODES
TO-92