637-10ABPE Wakefield Thermal Solutions, 637-10ABPE Datasheet

637-10ABPE

Manufacturer Part Number

637-10ABPE

Description

Heat Sink

Manufacturer

Wakefield Thermal Solutions

Datasheets

1.274-2AB.pdf (20 pages)

2.637-10ABPE.pdf (6 pages)

Specifications of 637-10ABPE

Packages Cooled

TO-220

Thermal Resistance

76Â°C/W

Width

34.9mm

Height

25.4mm

Heat Sink Material

Aluminum

Length

12.7mm

Size

1.0H X 1.375W X 0.500L"

Mounting Type

PC Board Through Hole

Package / Case

TO-220

Product

Heatsinks

Mounting Style

Through Hole

Heatsink Material

Aluminum

Dimensions

12.7 mm L x 34.9 mm W x 25.4 mm H

Designed For

TO-220

Color

Black

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

637-10ABPE

Manufacturer:

WAK

Quantity:

14 366

Current page: 1 of 6
Download datasheet (352Kb)

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-

cally mounting TO-220 and TO-218 components. Models are available with or without wave-

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.

Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight

All other products, please contact factory for price, delivery, and minimums.

Board Level

Heat Sinks

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Notes:

1. Thermal compound is

2. Tab temp with longer heat

assumed between device

and heat sink.

sink (634-20ABP) will

typically be about 15%

cooler. Tab temp with

shorter heat sink

(634- I0ABP) will typically

be about 25% higher.

634 SERIES

637-25ABP

Material: Aluminum, Black Anodized.

637 SERIES

Standard

P/N

637-10ABP

637-15ABP

637-20ABP

Material: Aluminum, Black Anodized

634-10ABP

634-15ABP

634-20ABP

Plain Pin

Standard

Slim Profile Unidirectional Fin Vertical Mount Heat Sink

High-Efficiency Heat Sinks For Vertical Board Mounting

P/N

PC Board “A”

1.000 (25.4)

1.500 (38.1)

2.000 (50.8)

2.500 (63.5)

Height Above

in. (mm)

Without Pin

634-10AB

634-15AB

634-20AB

(EXTRUSION PROFILE 5183)

634 SERIES

637 SERIES

1.375 (34.9) x 0.500 (12.7)

Maximum Footprint

in. (mm)

Height Above

1.000 (25.4)

1.500 (38.1)

2.000 (50.8)

PC Board

in. (mm)

solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications

where quick assembly is needed and space is at a premium.

and board space occupied must be minimized. Refer to the Accessory products section for

thermal interface materials, thermal compounds, and other accessories products.

0.640 (16.26) x 0.640 (16.26)

76°C @ 6W

55°C @ 6W

48°C @ 6W

Thermal Performance at Typical Load

65°C @ 6w

Convection

Natural

TYPICAL THERMAL PERFORMANCE

Dimensions

Footprint

in. (mm)

CONVECTION CHARACTERISTICS

FOR 634-15ABP

NATURAL AND FORCED

5.8°C/W @ 200 LFM

5.5°C/W @ 200 LFM

4.7°C/W @ 200 LFM

4.2°C/W @ 200 LFM

Convection

Forced

0.025 (11.21)

0.033 (14.95)

lbs. (grams)

0.016 (7.48)

TO-220 and TO-218

Weight

0.023 (10.43)

0.062 (28.12)

0.035 (15.88)

0.050 (22.68)

Normally stocked

lbs. (grams)

Weight

TO-220

Related parts for 637-10ABPE

637-10ABPE Summary of contents

Page 1

... Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES High-Efficiency Heat Sinks For Vertical Board Mounting Standard PC Board “A” P/N 637-10ABP 1.000 (25.4) 637-15ABP 1 ...

Page 2

...

Page 3

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard Standard P/N 626-10ABP 627-10ABP 626-15ABP 627-15ABP 626-20ABP 627-20ABP 626-25ABP 627-25ABP Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat ...

Page 4

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting Standard P/N 657-10ABPN 657-15ABPN 657-20ABPN 657-25ABPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat Sinks with SpeedClips™ ...

Page 5

... These 680 Series heat sinks can also be specified with- out any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). 680 SERIES SEMICONDUCTOR MOUNTING HOLES A ...

Page 6

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Standard Dimensions P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, ...

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