416201U00000G Aavid Thermalloy, 416201U00000G Datasheet
416201U00000G
Manufacturer Part Number
416201U00000G
Description
HEAT SINK HI CONTACT LCP 6 PASS
Manufacturer
Aavid Thermalloy
Type
Liquid Cooledr
Specifications of 416201U00000G
Thermal Resistance
0.001°C/W
External Width
177.8mm
Height
16.1mm
Heat Sink Material
Aluminium, Copper
External Height
16.1mm
Length
386.1mm
Package / Case
Liquid Tube Cold Plates
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Liquid-cooled Cold Plates
High Contact
HiContact
effective method of cooling high heat concentration
semiconductor devices without the expense, weight, or
handling problems associated with cold plates fabricated
completely from copper. Aavid-Thermalloy's HiContact
cooling technology ensures minimum contact resistance
between the heat producing device and the cooling fluid.
The tube utilized in the HiContact assembly minimizes the
number of thermal interface layers between the cooling
liquid and the heat producing devices. Liquid-cooled cold
plates offer optimum thermal management for high power
IGBT modules. They are ideal for use in stationary or
mobile applications requiring high power dissipation and
low thermal resistance - welding, plasma, UPS/power
supplies, and motor controls in traction and electric
vehicles.
Features
Products
Copper tube in direct contact with the heated devices
to handle high heat concentrations, reducing
semiconductor temperature rise
Aluminum mounting plate with copper cooling coil for
low cost, high value - lower weight than all copper
and easily modified/machined
High conductivity epoxy filler between tube and plate
Mounting surface machined smooth and flat for
reduced resistance at mounting interface,
maximizing heat transfer to cooling media and
insuring copper and aluminum and coplanar
/
TM
Liquid-cooled Cold Plates
assemblies (patent pending) are a cost-
/
High Contact
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416201U00000G Summary of contents
Page 1
Products Liquid-cooled Cold Plates High Contact / / Liquid-cooled Cold Plates High Contact TM HiContact assemblies (patent pending) are a cost- effective method of cooling high heat concentration semiconductor devices without the expense, weight, or handling problems associated with cold ...
Page 2
Minimum mounting plate thickness Heat transferred laterally and assembly locked together Minimized weight outside the primary thermal path specifications 2 Pass Models 6063-T5 aluminum Plate: 1.3 mm (.05") wall, copper Tube: Stainless steel tube can be substituted for copper Options: ...
Page 3
Pass Models 6063-T5 Aluminum Plate: 0.05 wall 3/8 dia. copper Tube: as required Options: Part Number "X" Dim Finish 416101U00000 6.00" Unfinished 416201U00000 12.00" Unfinished 416301U00000 24.00" Unfinished Gold 416101C00000 6.00" Chromate Gold 416201C00000 12.00" Chromate Gold 416301C00000 24.00" ...
Page 4
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