299-43-636-10-002000 Mill-Max Manufacturing Corp., 299-43-636-10-002000 Datasheet - Page 2
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299-43-636-10-002000
Manufacturer Part Number
299-43-636-10-002000
Description
IC SOCKET RT ANG 36PIN DIP .600
Manufacturer
Mill-Max Manufacturing Corp.
Type
DIP, 0.6" (15.24mm) Row Spacingr
Series
299r
Datasheets
1.299-93-308-11-001000.pdf
(1 pages)
2.299-93-308-11-001000.pdf
(1 pages)
3.299-43-636-10-002000.pdf
(3 pages)
Specifications of 299-43-636-10-002000
Number Of Positions Or Pins (grid)
36 (2 x 18)
Pitch
0.100" (2.54mm)
Mounting Type
Through Hole, Right Angle, Horizontal
Features
Closed Frame
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Number Of Contacts
36POS
Number Of Contact Rows
2
Row Spacing (mm)
15.24mm
Pitch (mm)
2.54mm
Grid Size
Not Required
Contact Plating
Gold Over Nickel
Insulation Material
Polychlorinated Terp
Mounting Style
Through Hole
Contact Material
BeCu Alloy
Operating Temp Range
-55C to 125C
Product Height (mm)
17.7mm
Product Depth (mm)
13.21mm
Product Length (mm)
45.7mm
Gender
SKT
Body Orientation
Right Angle
Current Rating
3A
Insulation Resistance
10Gohm
Contact Resistance Max
10mOhm
Voltage Rating
150VDC/100VAC
Product
DIP / SIP Sockets
Termination Style
Solder Pin
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
2994363610002000
ED90155
ED90155
Mill-Max Mfg. Corp. Datasheet — Last Modified 4/6/2011
INSULATOR INFORMATION:
PCT
Properties of PCT Polyester:
BRASS ALLOY
Properties of BRASS ALLOY:
High Temperature
This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all
applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.
This Certificate of Compliance covers the following requirements:
Dimensional (all features verified to be within tolerances described on the applicable drawing).
Raw Material (materials and properties verified to be as described on the applicable drawing).
Plating (platings as required, thickness verified, and performance including solderability per mil-standard).
Performance (insertion extraction or other force requirements as described on the applicable drawing).
Reference:
1. Directive 2002/95/EC of the European Parliament and of the Council of January 27 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
2. Directive 2003/11/EC which amends Council Directive 76/769/EC to include pentabromodiphenyl ether and
octabromodiphenyl ether.
3. Directive 2005/618/EC Commission decision of 18 August 2005 amending Directive 2002/95/EC. Establishes threshold
limits for Lead, Mercury, Cadmium, Hexavalent Chromium, PBB, and PBDE.
4. Judgment of the Court (Grand Chamber) 1 April 2008, Directive 2002/95/EC-Electrical and electronic equipment -
Decabromodiphenyl ether (Deca-BDE) Actions for annulment of exemption.
5. EU Directive 2006/122/EC of the European Parliament and of the Council of 12 December 2006, amending Council
Directive 76/769/EEC on the restriction of Perfluorooctanoic Acid (PFOA) and Perfluorooctane Sulfanates (PFOS) used
during metal plating processes.
In reference to the directives described above, MILL-MAX Mfg.Corp. declares that lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls, polybrominated diphenyl ethers, including pentabromodiphenyl ether,
octabromodiphenyl ether, decabromodiphenyl ether, Perfluorooctanoic Acid, and Perfluorooctane Sulfanates are not
intentionally added to the raw material or processes used for our certified RoHS compliant products except where described
and allowed under item 6 of the annex; Applications where lead mercury, cadmium, and hexavalent chromium, which are
exempted from the requirements of Article 4 (1) of reference 1. No warranty, liability of indemnification is expressed or
implied with this information.
RoHS Compliance Statement for the restriction of lead, mercury, cadmium and hexavalent chromium PBB,
Brand: Thermx
Grade: CG-933
Rated voltage: 100 VRMS/150 VDC
Insulation resistance: 10,000 Megaohms min.
Material Heat Deflection Temp (per ASTM D 648): 529°F (276°C) @ 66 psi
Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP)
Note: Materials above 446°F (230°C) are considered suitable for "eutectic" reflow soldering, above 500°F (260°C) for
"lead-free" reflow soldering.
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%†
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
†(3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin
materials are RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
Polyester, (Thermx CG933, black)
PBDE, including Octa-BDE, Penta-BDE, Deca -BDE, in electronic equipment and use of PFOA
(UNS C36000) per ASTM B 16
and PFOS in metal plating processes.
Certificate of Compliance:
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