OPAKIT-100 OPTEK TECHNOLOGY, OPAKIT-100 Datasheet - Page 13

• Manufacturer Part Number: OPAKIT-100
• Description: LED Development KIT
• Manufacturer: OPTEK TECHNOLOGY

Specifications of OPAKIT-100

• Tool / Board Applications: High Brightness LEDs
• Development Tool Type: Hardware / Software - Dev Kit (Dev Tool)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Issue A
Page B1
Insulated Aluminum Substrates
Thermal Solutions for Hi Brightness LED Applications
TT electronics is a leading designer and manufacturer of
electronic components. As a result of our experience
with power components, Anotherm
developed as an innovative method of addressing
thermal problems.
Anotherm
conductive aluminum alloy substrate, with a special
anodized aluminum oxide electrically insulating layer
chemically grown on the aluminum core. This high
temperature anodized layer offers good electrical
isolation and excellent thermal transfer. Screen-printed,
solderable conductors are then applied to the board and
fired.
The result is a low cost, rigid circuit board with
unsurpassed thermal efficiency. The completely inorganic
construction results in substrate characteristics that
maintain their properties even at high continuous
operating temperatures. This process also allows the use
of a wide range of substrate configurations including
finned and multi-up arrays.
Hi brightness, high power LEDs benefit from Anotherm
substrates, allowing excellent heat transfer from the LED
package, resulting in more light output and operation at
higher power levels.
Substrate Characteristics
Material
The base material for the Anotherm
aluminum alloy, either 3000 or 6000 series. This
aluminum alloy has a high thermal conductivity and low
cost. The thermal expansion coefficient of this material
corresponds favorably with traditional P.C. board
materials. Long term thermal shock testing confirms the
ruggedness
delamination or degradation.
Dielectric Layer
The insulation system used on the Anotherm
system is an anodically grown coating (similar to hard
coat anodizing), that deposits a dense, thin film of
aluminum oxide approximately 0.0017" thick (0.043mm)
onto the aluminum surface. This inorganic dielectric layer
gives a high quality insulation that is not affected by
temperature or chemicals.
10/05
TT electronics subsidiaries reserves the right to make changes at any time in order to improve design and to supply the best product possible.
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substrates consist of a highly thermally
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dielectric
medium
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Conductors
Silver alloy conductors are screen printed and fixed onto
the insulating dielectric layer. The standard conductor
thickness is approximately 20 microns, although thicker
conductors can be printed for higher current carrying
capability.
Multiple Layers
Anotherm
single layers on the front or backside of the board. When
multiple layers or printed crossovers are required,
polymer materials are used. As a result, the excellent
thermal conductivity properties of Anotherm
are lost in the additional layers. However, these traces
can be used for carrying low power and control signals.
Solder Masks
Printed solder masking is available using a polymeric
formulation.
Heatsinks
One interesting characteristic of this technology is the
capability of printing solderable conductors directly onto
heatsinks, thereby simplifying the assembly of power
systems.
Anotherm substrates offer very
This results in:
• Reduced operating temperature
• Higher operating power/density
• Improved reliability and reduced
high thermal conductivities with
low thermal resistance from the
die or chip to the substrate for
power LED applications.
failures due to thermally
induced problems.
®
substrates are ideal for applications requiring
Welwyn Components Limited — www.welwyn-tt.com
OPTEK Technology, Inc. — www.optekinc.com
IRC Advanced Film Division — www.irctt.com
®
substrates