AD9276-65EBZ Analog Devices Inc, AD9276-65EBZ Datasheet - Page 10

• Manufacturer Part Number: AD9276-65EBZ
• Description: 65MSPS ADC Converter Evaluation Board
• Manufacturer: Analog Devices Inc

Specifications of AD9276-65EBZ

• Silicon Manufacturer: Analog Devices
• Application Sub Type: ADC
• Kit Application Type: Data Converter
• Silicon Core Number: AD9276
• Number Of Adc's: 1
• Number Of Bits: 12
• Sampling Rate (per Second): 65M
• Data Interface: Serial, SPI™
• Inputs Per Adc: 1 Differential
• Input Range: *
• Power (typ) @ Conditions: 195mW @ 40MSPS
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9276
• Development Tool Type: Hardware - Eval/Demo Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9276
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD1 to GND
AVDD2 to GND
DRVDD to GND
GND to GND
AVDD2 to AVDD1
AVDD1 to DRVDD
AVDD2 to DRVDD
Digital Outputs (DOUTx+, DOUTx−,
CLK+, CLK−, SDIO to GND
LI-x, LO-x, LOSW-x to GND
CWI−, CWI+, CWQ−, CWQ+ to GND
PDWN, STBY, SCLK, CSB to GND
GAIN+, GAIN−, RESET, 4LO+, 4LO−,
RBIAS, VREF to GND
Operating Temperature Range (Ambient)
Storage Temperature Range (Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
DCO+, DCO−, FCO+, FCO−) to GND
GPO0, GPO1, GPO2, GPO3 to GND
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
−2.0 V to +2.0 V
−2.0 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. 0 | Page 10 of 48
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Airflow Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
20.3
14.4
12.9
JA
1
θ
7.6
JB
θ
4.7
JC
Unit
°C/W
°C/W
°C/W