BLKD945GSEJT Intel, BLKD945GSEJT Datasheet - Page 4

• Manufacturer Part Number: BLKD945GSEJT
• Description: BOARD, D945GSEJT W/ATOM PROC N270
• Manufacturer: Intel

Specifications of BLKD945GSEJT

• Kit Contents: ATX 2.2 Compliant I/O Shield, SATA Cable, Board, Back Panel Layout Sticker, Quick Reference Guide
• Kit Features: Integrated 45nm Intel Atom Processor, Express Chipset, Integrated 32-bit
• Silicon Manufacturer: Intel
• Features: PCI Support, 10/100/1000 Integrated LAN, Graphics Output

Technical Specifications
Processor
Processor Support
• Intel® Atom™ Processor N270 integrated
Chipset
• Intel® 945GSE Express Chipset with ICH7M
I/O Features
• Two SATA ports with SATA power connector
• One Parallel ATA port (44-pin mobile header)
• One PCI local bus slot
USB 2.0
• Three back panel ports
• Four front panel ports (via two internal headers;
Audio Solution
• 2-channel (single) / 2+2 channel (multi)
• Front panel mic/headphone header
• Internal speaker header
• Digital audio via S/PDIF
10/100/1000 Network Connection
• Realtek* 10/100/1000 Ethernet Controller
• Supported wireless via PCI Express Mini Card slot
SPI
System BIOS
• 4 Mb Flash EEPROM with Intel® BIOS featuring
Intel® Rapid BIOS Boot
• Optimized POST for fast access to PC from
System Memory
Memory Capacity
• Single-Channel DDR2 DIMM Socket (533)
• Designed to support up to 2 GB
Memory Type
• SODIMM DDR2 800 / 677 / 533
Memory Voltage
• 1.8 V
1
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Atom, and Intel Atom Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0309/KL/MS/PDF
Perform up to System Bus speed at 533 MHz.
(1.6 GHz / 512 KB L2 Cache / 533 System Bus)
support for single internal USB flash drive)
HD audio (analog)
with gPXE/iSCSI network boot support
Plug and Play, IDE drive auto-configure
power-on
1
Wake-up from Network
• Wired for Management (WfM) 2.0-compatible
• Support for system wake-up using an add-in
Expansion Capabilities
• One PCI slot
• One PCI Express Mini Card slot
Jumpers and Front-Panel Connectors
Jumpers
• Jumper access for BIOS configuration mode
Front Panel Connectors
• Reset, HD LED, Power LED, power on/off,
• Two USB 2.0 headers
• Audio header
Mechanical
Board Style
• Mini-ITX/microATX compatible
• 170mm x 170mm
• Total Z height of board 20mm
Desktop Board Power Requirements
• Primary: Rear 12 V DC jack for 60 W external
• Alternate: Internal +12 V 2 x 2 internal power
Environment
Operating Temperature
• 0° C to +35° C
Storage Temperature
• -20° C to +70° C
Regulations and Safety Standards
United States and Canada
Europe
International
network interface card with remote wake-up
capability
Wireless LED
power supply (GND via 5.5mm/OD; 12V
via 2.5mm/ID)
connector (for system with internal power supply)
CSA/UL 60950-1, First Edition
(Binational Standard)
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
IEC 60950-1:2001, First Edition
321436-002US
EMC Regulations
(tested in representative chassis)
United States
Canada
Europe
Australia/New Zealand
Japan
South Korea
Taiwan
International
Environmental Compliance
Europe
China
of the raw materials and the end product is not
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’ s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information, visit
developer.intel.com/products/desktop/
motherboard/
FCC 47 CFR Part 15, Subpart B
ICES-003, Issue-004 Class B
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
EN 55022:2006 Class B
VCCI V-3/2007.04, V-4/2007.04, Class B
KN-22:2005 and KN-24:2005
CNS 13438:2006 Class B
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Europe RoHS (Directive 2002/95/EC)
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any