RE900 ROTH ELEKTRONIK, RE900 Datasheet

RE900

Manufacturer Part Number

RE900

Description

SMD To Pin Out Adapter - TSOP Multiple

Manufacturer

ROTH ELEKTRONIK

Datasheet

1.RE900.pdf (1 pages)

Specifications of RE900

Board Type

PCB, IC To Pin Out Adapter

Board Material

FR-4

External Height

72.6mm

External Width

76.2mm

Board Thickness

1.5mm

Hole Diameter

1mm

Length/height, External

72.2mm

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Multiadapter - SMD TSOP I/II

RE900

- FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth)

- solder and component side with chemical NI/AU surface and solder stop mask

- pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil);

- hole dia Ø 1.00 mm

- adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips

- prescrachted rated break point for the separation of individual moduls from

- Gerber data for manufacture of the soldering paste imprint will be provided free of

- size: 72.60 x 76.20 mm

0.80 mm (30 mil); 1.27 mm (50 mil)

the board

charge on request

Modul-No

RE900-01

RE900-02

RE900-03

RE900-04

RE900-05

RE900-06

Type

TSOP I

TSOP II

Pitch

0.40

0.50

0.65

0.80

1.27

Pin/Quantity

28,40,48,60

28,32,40,48

20,24

16,24,28,36

40,44

20,24,26,28,32

Size max./mm

12 x 18

12 x 20

6 x 16

12 x 14

11.5 x 18.8

11.5 x 21.3

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