PRODUCT DESCRIPTION
LOCTITE
characteristics:
LOCTITE
adhesive.
Mil-A-46050C
LOCTITE
Specification Mil-A-46050C. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.
Commercial Item Description A-A-3097:
LOCTITE
Description A-A-3097. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
Technology
Chemical Type
Appearance (uncured)
Components
Viscosity
Cure
Application
Key Substrates
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Specific Gravity @ 25 °C
Viscosity, Cone & Plate, mPa·s (cP):
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Vapour Pressure, hPa
Flash Point - See MSDS
Fixture Time, seconds:
Temperature: 25 °C, Shear Rate: 100 s
Spindle 2, speed 12 rpm
Mild Steel (degreased)
Aluminum
Zinc dichromate
Neoprene
Rubber, nitrile
ABS
PVC
®
®
®
®
416™ is a general purpose cyanoacrylate instant
416™ is tested to the lot requirements of Military
416™ has been qualified to Commercial Item
416™
provides
Cyanoacrylate
Ethyl cyanoacrylate
Transparent clear liquid
One part - requires no mixing
High
Humidity
Bonding
Plastics, Rubbers and Metals
the
-1
following
1.05
<1
900 to 1,500
1,150 to 1,500
20 to 50
10 to 30
40 to 100
<5
<5
15 to 40
20 to 50
LMS
product
LMS
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity.
The following graph shows the tensile strength developed with
time on Buna N rubber at different levels of humidity.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
TYPICAL PERFORMANCE OF CURED MATERIAL
After 24 hours @ 22 °C
Adhesive Properties
After 24 hours @ 22 °C
Physical Properties:
Electrical Properties:
Lap Shear Strength, ISO 4587:
Polycarbonate
Phenolic
Coefficient of Thermal Expansion,
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
Softening Point, DIN EN 1427, °C
Dielectric Constant / Dissipation Factor, IEC 60250:
Volume Resistivity, IEC 60093, Ω·cm
Surface Resistivity, IEC 60093, Ω
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
Steel (grit blasted)
ISO 11359-2, K
100
0.1-kHz
1-kHz
10-kHz
75
50
25
0
0
LOCTITE
60% RH
10
-1
20
40% RH
30
N/mm² 18 to 26
(psi)
Technical Data Sheet
®
40
2×10
10×10
25
2 to 3.3 / <0.02
2 to 3.5 / <0.02
2 to 3.5 / <0.02
20% RH
(2,610 to 3,770)
30 to 70
10 to 40
15
416™
January-2010
15
100×10
0.1
165
to 10×10
to 80×10
50
-6
15
15
60
