A-4 Wakefield Thermal Solutions, A-4 Datasheet

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A-4

Manufacturer Part Number
A-4
Description
THERMAL ADHESIVE, BOTTLE, 0.316LB
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.173-7-240P.pdf (5 pages)

Specifications of A-4

Adhesive Type
Hardener
Adhesive Applications
Bonding - Thermal Heat Sink
Dispensing Method
Bottle
Weight
0.316lb
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
A-4.5W-K
Manufacturer:
OMRON
Quantity:
12 000
Company:
BOSTOCK HK LIMITED BOSTOCK HK LIMITED
Part Number:
A-40294
Manufacturer:
ST
0
Company:
BOSTOCK HK LIMITED BOSTOCK HK LIMITED
Part Number:
A-43189
Manufacturer:
ST
0
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
A-4708
Quantity:
2
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
A-48W-K
Manufacturer:
PANASONIC
Quantity:
12 000
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
120 SERIES
126 SERIES
Normally stocked
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces
with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable
increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period
(Time versus Thermal Resistivity graph below).
Case Style Characteristics
T0-3
TO-66
0.19 (4.8) stud x 0.44 (11.2) hex
0.38 (9.7) stud x 1.06 (26.9) hex
0.50 (12.7) stud x 1.06 (26.9) hex
TO-220
0.25 (6.4) stud x 0.69 (17.5) hex
0.75 (19.1) stud x 1.25 (31.8) hex
The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide
fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding
that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and
migration of silicone-based products.
Shelf life: 5 years.
Appearance
Solids Content, wt %
Thermal Conductivity at 36°C = 4.8 (Btu)(in.)/(hr) (ft
Interface Thermal Resistance
Bleed, 24 hrs at 200°C, wt%
Evaporation, 24 hrs at 200°C, wt%
Volume Resistivity
Dielectric Strength
Specific Gravity @ 60°F
Penetration
Operating Range
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Ø cs ) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Characteristics
126 SERIES THERMAL JOINT COMPOUND
125 (14.12)
600 (67.79)
Mounting Torque
in inch • pounds Resistance
30 (3.39)
75 (8.47)
15 (1.7)
9 (0.9)
8 (0.9)
8 (0.9)
(N•M)
69
2
) (°F)
Thermal
Typical
(°C/W)
0.09
0.14
0.50
0.16
0.10
0.07
0.07
0.052
Smooth, white homogeneous paste
65% min
19.0 X 10e 4 cal/sec cm °C, min
0.043°C/W TO-3 at 0.0008 thick film
0.09% max
0.6 max
2.3 x 10e 12 ohms/cm
200 volts/mil
2.93 (gm/cc)
280 to 320
-40°C to 200°C
All other products, please contact factory for price, delivery, and minimums.
Volume Resistivity
Dielectric Strength
Specific Gravity
Thermal Conductivity @ WC
Thermal Resistivity (P)
Bleed, % after 24 hrs @ 200°C
Evaporation, % after 24 hrs @ 200°C
Color
Shelf life
Operating Temperature Range (°C)
Description
120 SERIES - THERMAL JOINT COMPOUND
Characteristic
120-5
120-8
120-80
120-320
120-SA
120-2
Series -
120 SERIES - ORDER GUIDE
P/N
126-2
126-4
126-4S
126-5LB
Series -
5 oz (0.14 kg) tube
20 lb (9.08 kg) can
4 gram plastic pak
5 lb (2.27 kg) can
2 oz (0.06 kg) jar
8 oz (0.23 kg) jar
P/N
Container Size
126 SERIES - ORDER GUIDE
5 X 10e 14 ohm/cm
225 volts/mil
2.1 min.
0.735 W/(m)(K)
56 (°C)(in.)/watt
0.5
0.5
opaque white
5 years
-40/+200
5.1(Btu) (in.)/(hr)(ft
Description
4 oz (0.11 kg) syringe
4 oz (0.11 kg) tube
5 lb (2.27 kg) can
2 oz (0.6 kg) jar
Container Size
Accessory
Products
2
)(°F)

A-4 Summary of contents

Page 1

... It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal Resistivity graph below) ...

Page 2

... It produces a rigid, high strength bond to most materials when cured. DeltaBond™ 152 is available in bi-packs, kits, and quarts. Order one bottle of hardener A-4 or B-4 per one quart of DeltaBond™ 152 separately. Shelf life: 152KA 1 year, all others 2 years. ...

Page 3

... Working consistency (77°F) viscous liquid Working viscosity (77°F) cps 25,000 Hardener Part Number A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only) All other products, please contact factory for price, delivery, and minimums. Accessory Products B4 3.5 30 min 6 hrs 30 min 15 minn 4 hrs @ 200° ...

Page 4

... After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties. ‡ After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same full properties. ...

Page 5

... Hz -60/+200 -60/+200 1 x 10e -2 1.2 x 10e -3 0.50 0.25 0.40 350/550 350/550 T (torque [in.-lb (number of fasteners) 0 (Thread Dia (contact surface area square inches) Mechanical Dimensions in. (mm 0.562 (14.3) 0.218 (5.5) 0.125 (3.2) 0.500 (12.7) 0.160 (4.1) 0.141 (3.6) ...