425-01 MULTICORE (SOLDER), 425-01 Datasheet
425-01
Manufacturer Part Number
425-01
Description
FLUX, REWORK, MULTIFIX
Manufacturer
MULTICORE (SOLDER)
Datasheet
1.425-01.pdf
(2 pages)
Specifications of 425-01
Capacity
0.01l
Dispensing Method
Syringe
Volume
10cc
Adhesive Applications
Bonding - Thermal Heat Sink
REWORK FLUXES
Multifix 425-01 and 450-01 are tacky fluxes designed for
use in a wide range of electronics assembly and rework
processes. They represent a range of activities and
residue levels to meet different customer requirements.
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Both products are supplied in syringes or cartridges for
application by dispensing. The user should select the
product most appropriate to the application.
Multifix 450-01 leaves visible but clear residues that do not
require cleaning. It has good activity for rework operations.
Multifix 425-01 is less active. However, the residues are
clear and barely visible while soldering activity is still
sufficient for many users.
RECOMMENDED OPERATING CONDITIONS
There are many applications for these products and users
may find that their own process requires particular
conditions. The following information can therefore be for
guidance only.
The main function of these fluxes is threefold. They provide
a thermal pathway from the heat source to the workpiece,
ensuring that it is evenly heated. The viscous fluid protects
metal surfaces from rapid oxidation at soldering temperature
and, finally, they break down surface contaminants to allow
solder spread. On tin/lead surfaces, this may be a purely
physical effect causing oxide skins to flow away from the
molten coating but chemical dissolution may also be
required.
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
No Clean Formulations
Low residue
Range of activity to deal with different component
solderability
Halide free
Suitable for dispensing
Compatible with solder coatings and/or No Clean
flux cored solder wire product range
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
NOT FOR PRODUCT SPECIFICATIONS
PRODUCT.
MULTIFIX ™ 425-01 & 450-01
Where a component is to be soldered into place for the first
time, the alloy for the fillet may be provided by the fusible
coating on the PCB and to some extent, on the component
termination. The PCB may be of conventional design or it
can be specially fabricated with a flat, thick solder coating
(eg. produced by the Solid Solder Deposition (SSD)
process). In either case, Multifix 425-01 and Multifix 450-
01 will provide a sufficiently tacky surface to hold the
component in place.
When a component is to be soldered to a board having little
or no fusible coating, it may be necessary to use Multifix
425-01 or Multifix 450-01 to clean the surface to be joined.
Solder for the joint is supplied by wire which may be solid
or flux cored. If flux cored wire is used, it is recommended
that the low residue product Multicore X39 is selected since
the residues from this material are minimal and totally
compatible with both of these Multifix products.
Where components have been removed from a PCB, it is
important to prepare the site for the replacement device in
order that the resoldering process can be carried out
efficiently. Excess solder should be removed from the PCB
with Multicore MCF800.
Desoldering Wick and areas showing abnormally high levels
of oxidation may benefit from pretinning.
In all cases, a variety of heating methods may be used to
produce a solder joint with these products. These include
soldering irons, hot gas and hot bar devices, condensation
reflow and IR/convection reflow. Specialist tools and
workstations are available to assist operators but skill will
often be required to adapt these to particular situations. Both
Multifix 425-01 and Multifix 450-01 are tolerant of a wide
range of temperature profiles and any residues left after
reflow will be hard, clear and non-tacky.
TECHNICAL SPECIFICATION
The following Table summarises typical product properties.
Full details of test methods are available on request.
Technical Data Sheet
September 2006
425-01 Summary of contents
Page 1
... When a component soldered to a board having little or no fusible coating, it may be necessary to use Multifix 425-01 or Multifix 450-01 to clean the surface to be joined. Solder for the joint is supplied by wire which may be solid or flux cored. If flux cored wire is used recommended that the low residue product Multicore X39 is selected since the residues from this material are minimal and totally compatible with both of these Multifix products ...
Page 2
... Europe Henkel Loctite Adhesives Ltd Technologies House, Wood Lane End Hemel Hempstead Hertfordshire HP2 4RQ, United Kingdom +44 (0) 1442 278 000 Multifix 425-01 & 450-01, September 2006 Asia Henkel Loctite (China) Co. Ltd No. 90 Zhujiang Road Yantai Development Zone Shandong, China 264006 ...