M24308/2-2F Cinch Connectors, M24308/2-2F Datasheet - Page 4

• Manufacturer Part Number: M24308/2-2F
• Description: D SUB CONNECTOR, STANDARD, 15POS, RCPT
• Manufacturer: Cinch Connectors
• Type: Cable Socketr

Specifications of M24308/2-2F

• No. Of Contacts: 15
• D Sub Shell Size: DA
• Connector Body Material: Metal
• Gender: Receptacle
• Contact Termination: Crimp
• No. Of Mating Cycles: 500
• Body Material: Steel
• Connector Type: D Sub
• Angle: Straight
• Application: True MIL
• Brand/series: M24308
• Contact Plating: Gold over Nickel
• Current, Rating: 5 A
• Finish, Housing: Zinc Chromate
• Material, Contact: Phosphor Bronze
• Material, Dielectric: Diallyl Phthalate
• Material, Housing: Steel
• Number Of Contacts: 15
• Number Of Rows: 2
• Primary Type: D-Subminiature
• Shell Size: A
• Standards: MIL-C-24308
• Termination: Crimp

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
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