2000896-1 Tyco Electronics, 2000896-1 Datasheet - Page 4

• Manufacturer Part Number: 2000896-1
• Description: BACKPLANE CONNECTOR, RECEPT, 90POS
• Manufacturer: Tyco Electronics
• Series: Fortis Zdr

Specifications of 2000896-1

• Row Pitch: 1.6mm
• Pitch Spacing: 1.9mm
• No. Of Contacts: 90
• Gender: Receptacle
• Contact Termination: Press Fit
• No. Of Rows: 9
• Contact Plating: Gold
• Connector Type: Backplane
• Product Type: Contact Modules
• Contact Gender: Socket (Female)
• Number Of Positions / Contacts: 90
• Mounting Style: PCB
• Mounting Angle: Vertical
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.2. Connector Configuration
The minimum and maximum amount of modules used in a configuration and possible connector configurations
are shown in Figure 5. The configurations shown include guide hardware.
2. REFERENCE MATERIAL
2.1. Revision Summary
Revisions to this application specification include:
2.2. Customer Assistance
Reference Product Base Part Number 200896 and Product Code L059 are representative of the Fortis Zd pc
board connector system. Use of these numbers will identify the product line and expedite your inquiries through
a service network established to help you obtain product and tooling information. Such information can be
obtained through a local Representative or, after purchase, by calling PRODUCT INFORMATION at the
number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, the information contained in the Customer Drawings takes priority.
2.4. Specifications
Design Objective 108- -2409 provides expected product performance and test information.
2.5. Instructional Material
Instruction Sheets (408- - series) provide product assembly instructions or tooling setup and operation
procedures and Customer Manuals (409- -series) provide machine setup and operating procedures.
There are no documents available that pertain to this product.
2.6. Standards and Publications
Standards and publications developed by the Institute of Electrical and Electronics Engineers (IEEE) provide
industry test and performance requirements. Documents available which pertain to this product are:
3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Storage
4 of 18
IEC 60352- - 5, “Solderless Connections Part 5: Press- -In Connections — General Requirements, Test
Methods and Practical Guidance
S
S
S
S
A. Shelf Life
The modules should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The modules should be used on a first in, first out basis to avoid storage contamination that
could adversely affect performance.
B. Chemical Exposure
Do not store modules near any chemical listed below as they may cause stress corrosion cracking in the
contacts.
Alkalies
Amines
Changed company logo
Modified purpose of connector mating features and changed mating offset dimension in Section 1
Added Paragraph 2.6
Changed pressure to force and corrected unit of measure in Paragraph 3.6,B
Ammonia
Carbonates
Citrates
Nitrites
Phosphates Citrates
Sulfur Nitrites
Sulfur Compounds
Tartrates
114- - 13267
Rev B