EXC3BB221H Panasonic, EXC3BB221H Datasheet - Page 2

• Manufacturer Part Number: EXC3BB221H
• Description: CHIP BEAD CORE, SMD, 1608, 0.3OHM, 200mA
• Manufacturer: Panasonic
• Series: EXC3Br

Specifications of EXC3BB221H

• Impedance: 220ohm
• Frequency Range: 100MHz
• Dc Resistance Max: 0.3ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 1608
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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● Explanation of Part Numbers
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Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Construction
Type: EXCML
Construction
Noise Filter
E
1
Ferrite core
Product Code
Conductor
X
2
Multilayer
Chip type
C
3
Ferrite core
Bead core
Type
Electrode
M
4
Electrode
Part kind
L
5
Code
45
32
20
16
Dimensions (mm)
2
6
4.5x1.6 x1.1
3.2x1.6 x0.9
2.0x1.25x0.9
1.6x0.8 x0.8
Size
0
7
■
■
EXCCL4532
EXCCL3225
EXCCL3216
Dimensions in mm (not to scale)
Material
Dimensions in mm (not to scale)
EXCML16
EXCML20
EXCML32
EXCML45
(inches)
(inches)
(0603)
(0805)
(1206)
(1806)
(1812)
(1210)
(1206)
Type
Type
A
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
8
4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
3
9
Nominal Impedance
1.6 ± 0.2
2.0 ± 0.2 1.25 ± 0.20 0.9 ± 0.2
3.2 ± 0.3
4.5 ± 0.3
e
L
L
A
L
Dimensions (mm)
Dimensions (mm)
10
9
0.8 ± 0.2
1.6 ± 0.3
1.6 ± 0.3
L
W
W
Code
A
U
H
11
0
0.8 ± 0.2
0.9 ± 0.2
1.1 ± 0.2
Embossed Carrier Taping
Embossed Carrier Taping
H
T
Chip Bead Cores
(EXCML16 to 32)
W
Form
(EXCML45)
12
U
Packing
T
(0.4)
(0.5)
(0.6)
(0.6)
A
e
[mg/pc.]
[mg/pc.]
(Weight)
(Weight)
125.8
Mass
Mass
60.5
10.5
21.5
36.0
Feb. 2006
37
4.5