PM0805-R39K Bourns Inc., PM0805-R39K Datasheet
PM0805-R39K
Manufacturer Part Number
PM0805-R39K
Description
CHIP INDUCTOR, 390NH, 200mA, 10%, 700MHZ
Manufacturer
Bourns Inc.
Series
PM0805r
Datasheet
1.PM0805-R10K-RC.pdf
(1 pages)
Specifications of PM0805-R39K
Dc Resistance Max
1.5ohm
Dc Current Rating
200mA
Ferrite Case Style
0805
Inductor Type
Standard
Self Resonant Frequency
700MHz
Body Material
Ceramic
No. Of Pins
2
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
REV. 10/08
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications
Bourns Part No.
PM0805-2N8M-RC
PM0805-3N3M-RC
PM0805-5N6M-RC
PM0805-6N8M-RC
PM0805-8N2M-RC
PM0805-10NM-RC
PM0805-12NM-RC
PM0805-15NM-RC
PM0805-18NM-RC
PM0805-22NM-RC
PM0805-27NM-RC
PM0805-33NM-RC
PM0805-39NM-RC
PM0805-47NM-RC
PM0805-56NK-RC
PM0805-68NK-RC
PM0805-82NK-RC
PM0805-R10K-RC
PM0805-R12K-RC
PM0805-R15K-RC
PM0805-R18K-RC
PM0805-R22K-RC
PM0805-R27K-RC
PM0805-R33K-RC
PM0805-R39K-RC
PM0805-R56K-RC
Packaging Specifi cations
Electrical Specifi cations
178.0
(7.00)
DIA.
(.827 ± .031)
21.0 ± 0.8
(.512 ± .020)
13.0 ± 0.5
DIA.
(.079 ± .020)
2.0 ± 0.5
100
120
150
180
220
270
330
390
560
2.8
3.3
5.6
6.8
8.2
nH
10
12
15
18
22
27
33
39
47
56
68
82
Inductance
Tol. % Min.
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
(.512 ± .020)
13.0 ± 0.5
(.492)
DIA.
12.5
(.393)
10.0
32
30
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
50
50
50
50
45
45
45
23
Q
Test Frequency (MHz)
(1.969)
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
100
100
100
100
100
100
Features
■
■
■
■
■
■
■
50
50.0
PM0805 Series - High Q Chip Inductors
L
Formerly
0805 size
Available in E12 series
High Q up to 60 typ.
High operating temperature of 125 °C
Lead Free
RoHS compliant*
1000
1500
1000
1000
1000
500
500
500
500
500
500
500
500
500
500
500
500
500
250
250
250
250
250
250
250
50
Q
J. W .Miller
(MHz)
6000
6000
5800
5800
5500
4800
4100
3600
3400
3300
2600
2400
2100
1700
1600
1450
1350
1200
1100
SRF
Min.
950
900
860
850
800
780
340
THICKNESS
model
(.004)
EMBOSSED
CARRIER
0.10
MAX.
RDC
0.06
0.08
0.08
0.06
0.06
0.08
0.08
0.08
0.08
0.10
0.12
0.15
0.18
0.15
0.25
0.27
0.32
0.43
0.48
0.67
0.85
1.10
1.46
1.65
2.20
1.90
(Ω)
(.315)
8.0
EMBOSSED
CAVITY
I rms
Max.
(mA)
800
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
400
400
400
350
300
250
200
170
230
Applications
■
■
■
Temperature Rise
Operating Temperature
Storage Temperature
Refl ow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
Core Material .......Alumina (1CC201211)
Wire .......Enamelled Copper (1W1E180)
Terminal .......................... Mo/Mn+Ni+Au
Packaging ................. 2,000 pcs. per reel
Mobile phones
Cellular phones
CTV, VCR, HIC, FDD
General Specifi cations
Materials
Recommended Layout
Product Dimensions
REF.
.................40 ˚C max. at rated current
............................... -40 °C to +125 °C
............................... -40 °C to +125 °C
...............................260 ˚C, 5 seconds
(.020)
0.5
(.040)
REF.
1.02
(.020)
(.030)
DIMENSIONS:
0.76
0.5
(.083 ± .008)
2.1 ± 0.2
(.051 ± .008)
(INCHES)
1.3 ± 0.2
MM
(.040)
(.059 ± .008)
1.02
(.070)
1.78
1.5 ± 0.2
(.020)
0.5
REF.
REF.
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