ECLAMP2340C.WCT Semtech, ECLAMP2340C.WCT Datasheet

ECLAMP2340C.WCT

Manufacturer Part Number

ECLAMP2340C.WCT

Description

EMI POWER LINE FILTER, 0.5UA

Manufacturer

Semtech

Datasheets

1.ECLAMP2340C.pdf (10 pages)

2.ECLAMP2340C.WCT.pdf (10 pages)

Specifications of ECLAMP2340C.WCT

Voltage Rating

Leakage Current Max

500nA

Capacitance

27pF

Termination Type

SMD

Leaded Process Compatible

Yes

Peak Reflow Compatible (260 C)

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

ECLAMP2340C.WCT

Manufacturer:

MURATA

Quantity:

180

Company:

Meier Automation Equipment Co., Limited

Part Number:

ECLAMP2340C.WCT

Manufacturer:

SEMTECH/美国升特

Quantity:

20 000

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The EClamp

integrated TVS diodes. It is designed to suppress

unwanted EMI/RFI signals and provide electrostatic

discharge (ESD) protection in portable electronic

equipment. This state-of-the-art device utilizes solid-

state silicon-avalanche technology for superior clamp-

ing performance and DC electrical characteristics.

They have been optimized for protection of color

LCD panels

LCD panels in cellular phones and other portable

electronics.

The device consists of ten identical circuits comprised

of TVS diodes for ESD protection, and a resistor -

capacitor network for EMI/RFI filtering. A series

resistor value of 100

18pF is used to achieve 20dB minimum attenuation

from 800MHz to 3GHz. Each line features two stages

of TVS diode protection. The TVS diodes provide

effective suppression of ESD voltages in excess of

15kV (air discharge) and 8kV (contact discharge) per

IEC 61000-4-2, level 4.

The device is a 25-bump, 0.5mm pitch flip chip array

with a 5x5 bump grid. It measures 2.6 x 2.6 x

0.65mm. The solder bumps have a nominal diameter

of 0.315mm.

Revision 09/02/2004

LCD panels

PROTECTION PRODUCTS

PROTECTION PRODUCTS - EMIClamp

Description

Circuit Diagram

2340C is a low pass filter array with

LOW PASS FILTER

R = 100 Ohms

Circuit 10x

and a capacitance value of

= 18pF

protection of color

Features

Mechanical Characteristics

Applications

PIN Configuration

Flip Chip bidirectional EMI/RFI filter with

integrated ESD protection

ESD protection to IEC 61000-4-2 (ESD) Level4,

+/-15kV (air), +/-8kV (contact)

Filter performance: 20dB minimum attenuation

800MHz to 3GHz

TVS working voltage: 5V

Resistor: 100 Ohms

Input Capacitance: 18pF (VR = 2.5V

Protection and filtering for ten lines

Solid-state technology

JEDEC MO-211, 0.50 mm pitch flip chip

Nominal Dimensions: 2.6 x 2.6 x 0.65 mm

Bump Diameter: 315+/-20 m

Non-conductive top side coating

Marking : Mark code, lot code, orientation mark

Packaging : Tape and Reel per EIA 481

Color LCD Panel Protection

Cell Phone CCD Camera Lines

Personal Digital Assistants (PDA’s)

EMI Filter and ESD Protection

5 x 5 Grid Flip Chip (Ball Side View)

for Color LCD Interface

EClamp2340C

PRELIMINARY

www.semtech.com

)

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