MF-SM013/250V-0 Bourns Inc., MF-SM013/250V-0 Datasheet - Page 2

• Manufacturer Part Number: MF-SM013/250V-0
• Description: PTC - 5.4MM SURFACE MOUNT
• Manufacturer: Bourns Inc.
• Series: MF-SMr

Specifications of MF-SM013/250V-0

• Voltage - Max: 250V
• Current - Max: 3A
• Current - Hold (ih) (max): 130mA
• R Min/max: 6.500 ~ 12.00 Ohm
• Package / Case: Non-Standard SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Trip (it): -
• Time To Trip: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Packaging:
TAPE & REEL: 1500 pcs. per reel
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
The recommended long term storage conditions for Multifuse
devices should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifi cations if these storage
recommendations are exceeded. Devices stored in this manner have an indefi nite shelf life.
Additional Features
■
MF-SM013/250-2
MF-SM013/250-A-2
MF-SM013/250-B-2
MF-SM013/250-C-2
Product Dimensions
Solder Refl ow Recommendations
Storage Recommendations
Withstands lightning power induction
300
250
200
150
100
50
MF-SM013/250 - Telecom PTC Resettable Fuses
0
Model
A
Preheating
160–220
C
Time (seconds)
(0.370)
(0.370)
(0.370)
(0.370)
Max.
9.4
9.4
9.4
9.4
A
End View
Soldering
10–20
E
(0.146)
(0.146)
(0.146)
(0.146)
Max.
3.7
3.7
3.7
3.7
B
DIMENSIONS:
Cooling
120
®
(0.291)
(0.291)
(0.291)
(0.291)
Max.
Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All
7.4
7.4
7.4
7.4
D
C
(INCHES)
Side View
MM
Solder refl ow
•
•
•
•
•
Note:
•
Rework
•
(0.012)
(0.012)
(0.012)
(0.012)
Nom.
0.3
0.3
0.3
0.3
D
Recommended refl ow methods: IR, vapor phase oven, hot air oven.
Devices are not designed to be wave soldered to the bottom side of the
board.
Gluing the devices is not recommended.
Recommended maximum paste thickness is 0.25 mm (.010 inch).
Devices can be cleaned using standard industry methods and solvents.
If refl ow temperatures exceed the recommended profi le, devices may not
meet the performance requirements.
A device should not be reworked.
B
(0.149)
(0.149)
(0.149)
(0.149)
Terminal material:
Tin-plated brass
Nom.
3.8
3.8
3.8
3.8
E
(0.383)
(0.383)
(0.383)
(0.383)
Nom.
9.7
9.7
9.7
9.7
G
H
Recommended Pad Layout
Nom.
(0.18)
(0.18)
(0.18)
(0.18)
4.6
4.6
4.6
4.6
H
I
G
(0.071)
(0.071)
(0.071)
(0.071)
Nom.
1.8
1.8
1.8
1.8
I
H
I